Invention Grant
- Patent Title: Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same
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Application No.: US14721942Application Date: 2015-05-26
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Publication No.: US09635768B2Publication Date: 2017-04-25
- Inventor: Hyojae Bang , Dogeun Kim , Hongkyun Kim , Youngbok Jeon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2008-0088919 20080909
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G06K7/00 ; H01R12/57 ; H01R12/50 ; H05K1/11 ; H01R13/00 ; H05K3/10 ; H05K3/30 ; H05K7/02 ; H05K13/00 ; G06F1/18 ; H05K1/18 ; H01R27/00 ; H05K1/02 ; H05K3/34

Abstract:
Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices arid methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.
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Information query