Invention Grant
- Patent Title: Resin composition, prepreg, and substrate employing the same
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Application No.: US14266405Application Date: 2014-04-30
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Publication No.: US09642249B2Publication Date: 2017-05-02
- Inventor: Wei-Ta Yang , Li-Chun Liang , I-Hong Lin , Chung-Cheng Lin
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW102115370A 20130430; TW103113346A 20140411
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B29B7/90 ; B29K69/00
Abstract:
A disclosure provides a resin composition, a prepreg, and a substrate employing the same. According to an embodiment of the disclosure, the resin composition includes a polyphenylene ether compound, and a bismaleimide. The prepreg includes a cured product of the resin composition. The substrate includes a product fabricated by the resin composition or the prepreg.
Public/Granted literature
- US20140322545A1 RESIN COMPOSITION, PREPREG, AND SUBSTRATE EMPLOYING THE SAME Public/Granted day:2014-10-30
Information query
