- 专利标题： Method of manufacturing a printed circuit board assembly sheet
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申请号： US14141705申请日： 2013-12-27
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公开(公告)号： US09642262B2公开(公告)日： 2017-05-02
- 发明人: Jun Ishii , Terukazu Ihara , Naohiro Terada
- 申请人： Nitto Denko Corporation
- 申请人地址： JP Ibaraki-shi, Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Ibaraki-shi, Osaka
- 代理机构： Panitch Schwarze Belisario & Nadel LLP
- 优先权： JP2010-177632 20100806
- 主分类号： H05K3/02
- IPC分类号： H05K3/02 ; H05K3/10 ; H05K3/46 ; H05K1/02 ; H05K3/00 ; G11B5/48
摘要：
A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.
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