Invention Grant
- Patent Title: Thermionically-overdriven tunnel FETs and methods of fabricating the same
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Application No.: US14593636Application Date: 2015-01-09
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Publication No.: US09647098B2Publication Date: 2017-05-09
- Inventor: Borna Obradovic , Robert C. Bowen , Dharmendar Reddy Palle , Mark S. Rodder
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/16 ; H01L29/20 ; H01L29/10 ; H01L29/161 ; H01L29/739 ; H01L29/06 ; H01L21/311 ; H01L21/22 ; H01L29/78

Abstract:
A field effect transistor (FET) includes a nanosheet stack having first and second stacked semiconductor channel layers. The first channel layer defines a channel region of a tunnel FET, and the second channel layer defines a channel region of a thermionic FET. Source and drain regions are provided on opposite sides of the nanosheet stack such that the first and second channel layers extend therebetween. A first portion of the source region adjacent the first channel layer and a second portion of the source region adjacent the second channel layer have opposite semiconductor conductivity types. Related fabrication and operating methods are also discussed.
Public/Granted literature
- US20160020305A1 THERMIONICALLY-OVERDRIVEN TUNNEL FETS AND METHODS OF FABRICATING THE SAME Public/Granted day:2016-01-21
Information query
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