Invention Grant
- Patent Title: Pogo pin and probe card, and method of manufacturing a semiconductor device using the same
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Application No.: US14472449Application Date: 2014-08-29
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Publication No.: US09651577B2Publication Date: 2017-05-16
- Inventor: Sung-Ho Joo , Yu-Kyum Kim , Joon-Yeon Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0108191 20130910
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R1/073 ; G01R1/067

Abstract:
A pogo pin may include a housing, a resilient connecting member and a switching unit. The housing may be arranged between a printed circuit board (PCB) and a probing head. The resilient connecting member may be arranged in the housing to electrically connect the PCB with the probing head. The switching unit may be provided in the housing to selectively cut off an electrical connection between the PCB and the probing head. Thus, because the PCB may not require additional switching substrates, the PCB may have a small size so that the probe card may also have a small size. A semiconductor device may be manufactured using the probe card.
Public/Granted literature
- US20150070038A1 POGO PIN AND PROBE CARD, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2015-03-12
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