公开(公告)号：US10309987B2

公开(公告)日：2019-06-04

申请号：US15706996

申请日：2017-09-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yu-Kyum Kim ,  Gyu-Yeol Kim ,  Jae-Won Kim

IPC: G01R1/073 ,  G01R1/067 ,  H04N1/32 ,  H04N1/00

Abstract: A probe includes a beam and at least two tips. The beam transmits test signals to a device under test (DUT). The at least two tips are arranged on a first end portion of the beam in a direction at a predetermined angle to a length direction of the beam and contacts adjacent terminals of the DUT. The beam has a larger width that exceeds a sum of widths of the at least two tips in a width direction of the beam such that the probe has an improved current carrying capacity and is prevented from being damaged due to overcurrent.

公开(公告)号：US09651577B2

公开(公告)日：2017-05-16

申请号：US14472449

申请日：2014-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Ho Joo ,  Yu-Kyum Kim ,  Joon-Yeon Kim

IPC: G01R31/20 ,  G01R1/073 ,  G01R1/067

CPC classification number: G01R1/07378 ,  G01R1/06722 ,  G01R1/07371

Abstract: A pogo pin may include a housing, a resilient connecting member and a switching unit. The housing may be arranged between a printed circuit board (PCB) and a probing head. The resilient connecting member may be arranged in the housing to electrically connect the PCB with the probing head. The switching unit may be provided in the housing to selectively cut off an electrical connection between the PCB and the probing head. Thus, because the PCB may not require additional switching substrates, the PCB may have a small size so that the probe card may also have a small size. A semiconductor device may be manufactured using the probe card.

公开(公告)号：US12038458B2

公开(公告)日：2024-07-16

申请号：US17524841

申请日：2021-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hoon Lee ,  Gyuyeol Kim ,  Yu-Kyum Kim ,  Hanjik Nam ,  Sehoon Park ,  Young Jun Park ,  Seungwon Jeong ,  Woojun Choi

IPC: G01R1/073 ,  G01R1/04 ,  G01R1/067

CPC classification number: G01R1/07342 ,  G01R1/06727

Abstract: A probe for testing a semiconductor device includes a post having a plate shape and connected to a test substrate. A beam has a first end connected to the post. A tip structure is connected to a second end of the beam. The post includes a front surface having a normal line extending in a first direction. A back surface is located opposite to the front surface. Bumps are disposed on the front surface and are spaced apart from each other. The beam extends in a second direction intersecting the first direction. Each of the bumps protrudes from the front surface in the first direction by a first length.