A conductive insert which provides a low resistance bond between low conductive materials. The insert includes a first surface and an oppositely facing second surface. A plurality of openings extends between the first surface and the second surface. At least one first projection extends from the first surface proximate respective first openings, the at least one first projections extend from the first surface in a direction away from the second surface. At least one second projection extends from the second surface proximate respective second openings, the at least one second projections extend from the second surface in a direction away from the first surface.