Invention Grant
- Patent Title: Light-emitting diode chip package
-
Application No.: US14819355Application Date: 2015-08-05
-
Publication No.: US09659914B2Publication Date: 2017-05-23
- Inventor: Yi-Jyun Chen , Chih-Hao Lin , Hsin-Lun Su , Fang-Chang Hsueh
- Applicant: LEXTAR ELECTRONICS CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: Lextar Electronics Corporation
- Current Assignee: Lextar Electronics Corporation
- Current Assignee Address: TW Hsinchu
- Priority: TW104105987A 20150225
- Main IPC: H01L29/18
- IPC: H01L29/18 ; H01L33/00 ; H01L25/075 ; H01L23/498 ; H01L27/15 ; H01L33/50 ; H01L33/62 ; H01L33/44
Abstract:
A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the LED chip set.
Public/Granted literature
- US20160247787A1 LIGHT-EMITTING DIODE CHIP PACKAGE Public/Granted day:2016-08-25
Information query
IPC分类:
