Invention Grant
- Patent Title: Methods for molding integrated circuits
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Application No.: US13485307Application Date: 2012-05-31
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Publication No.: US09662812B2Publication Date: 2017-05-30
- Inventor: Chih-Hao Chen , Hsien-Wen Liu , Yi-Lin Tsai , Jui-Pin Hung , Jing-Cheng Lin
- Applicant: Chih-Hao Chen , Hsien-Wen Liu , Yi-Lin Tsai , Jui-Pin Hung , Jing-Cheng Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: B29C43/18
- IPC: B29C43/18 ; H01L21/56 ; H01L23/31 ; H01L23/00
Abstract:
A method includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature.
Public/Granted literature
- US20130207306A1 Methods for Molding Integrated Circuits Public/Granted day:2013-08-15
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