Invention Grant
- Patent Title: Semiconductor package with barrier for radio frequency absorber
-
Application No.: US15066454Application Date: 2016-03-10
-
Publication No.: US09666538B1Publication Date: 2017-05-30
- Inventor: David Bolognia
- Applicant: ANALOG DEVICES, INC.
- Applicant Address: US MA Norwood
- Assignee: ANALOG DEVICES, INC.
- Current Assignee: ANALOG DEVICES, INC.
- Current Assignee Address: US MA Norwood
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/552 ; H01L23/053 ; H01L23/08 ; H01L23/66 ; H01L23/538 ; H01L23/31
Abstract:
Semiconductor packages and methods of manufacturing semiconductor packages are described herein. In certain embodiments, the semiconductor package includes a housing including a first compartment and a second compartment, the first and second compartments being divided from one another. The semiconductor package can also include an integrated device die disposed in the first compartment, and a radio frequency (RF) absorber disposed in the second compartment.
Information query
IPC分类:
