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    SEAL FOR SEMICONDUCTOR PACKAGE
    1.
    发明申请
    SEAL FOR SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20170263515A1

    公开(公告)日：2017-09-14

    申请号：US15066397

    申请日：2016-03-10

    Applicant: ANALOG DEVICES, INC.

    Inventor： David Bolognia ,  Jingwen Zhu

    IPC: H01L23/053 ,  H01L23/16

    CPC classification number: H01L23/053 ,  H01L23/10 ,  H01L24/06 ,  H01L2924/16195

    Abstract: Semiconductor packages and methods of manufacturing semiconductor packages are described herein. In certain embodiments, the semiconductor package includes a substrate, a wall attached to the substrate, a first adhesive layer disposed between a bottom surface of the wall and a top surface of the substrate, and a second adhesive layer disposed around an outer perimeter of the first adhesive layer, the second adhesive layer disposed adjacent and contacting the wall, the second adhesive layer different from the first adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer connects the wall to electrical ground.

    Optical illuminator module and related techniques
    3.
    发明授权
    Optical illuminator module and related techniques 有权

    公开(公告)号：US10732265B1

    公开(公告)日：2020-08-04

    申请号：US16382042

    申请日：2019-04-11

    Applicant: Analog Devices, Inc.

    Inventor： Krishnan Ramaswamy Parameswaran ,  Xu Tang ,  Ying-Ju Wang ,  Weidong Wang ,  David Bolognia ,  Scott Robert Davis ,  Christophe Antoine ,  Brian Hall

    IPC: G01S7/481 ,  H01S5/022 ,  G02F1/295 ,  H01S5/00 ,  H01S5/024 ,  G02B26/08 ,  H01S3/23

    Abstract: An optical illuminator assembly such as an integrated module can provide an illumination source for use in applications such as optical detection. A peak output power of the module can be enhanced as compared to other approaches, such as by one or more of controlling parasitic effects along an electrical pathway used to drive an optical emitter circuit included as a portion of the module, or by providing thermal management including establishing thermal conduction pathways through opposite surfaces of an optical emitter circuit such as an integrated circuit die comprising a solid-state optical emitter. Control schemes can be used that power various cells or functional blocks of the optical emitter independently. Thermal regulation can be provided by an active heat transfer element such as a thermoelectric cooler (TEC). An optical illuminator assembly can be optically coupled to a beam-steering device or other elements, such as using a self-aligning mechanical configuration.

    Compact device package
    4.
    发明授权
    Compact device package 有权

    公开(公告)号：US08963307B2

    公开(公告)日：2015-02-24

    申请号：US13739953

    申请日：2013-01-11

    Applicant: Analog Devices, Inc.

    Inventor： David Bolognia

    IPC: H01L23/04 ,  H01L25/16 ,  G06K9/00 ,  H01L23/538 ,  H01L25/18 ,  H04R25/00

    Abstract: Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another. The substrate can be shaped to include two bends. First and second integrated device dies can be mounted on opposite sides of the substrate between the two bends in various arrangements.

    Microphone System with Integrated Passive Device Die
    5.
    发明申请
    Microphone System with Integrated Passive Device Die 有权
    集成无源器件模具麦克风系统

    公开(公告)号：US20140103464A1

    公开(公告)日：2014-04-17

    申请号：US13652950

    申请日：2012-10-16

    Applicant: ANALOG DEVICES, INC.

    Inventor： David Bolognia ,  Alain Valentin Guery

    IPC: H01L27/20 ,  H01L21/60

    CPC classification number: B81C1/00253 ,  B81B2207/012 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01L2924/3011 ,  H04R1/04 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A microphone system has a package forming an interior chamber, and a MEMS microphone secured within the interior chamber. The package forms an aperture for permitting acoustic access to the interior of the chamber and thus, the MEMS microphone. The system also has two dies; namely, the system has a primary circuit die within the interior chamber, and an integrated passive device die electrically connected with the primary circuit die. The primary circuit die is electrically connected with the MEMS microphone and has at least one active circuit element.

    Abstract translation: 麦克风系统具有形成内部室的封装和固定在内部室内的MEMS麦克风。 该封装形成用于允许声学接近室的内部并因此形成MEMS麦克风的孔。 该系统还有两个模具; 即该系统在内部室内具有初级电路管芯，以及与初级电路管芯电连接的集成无源器件管芯。 主电路管芯与MEMS麦克风电连接并具有至少一个有源电路元件。

    Transducer with Enlarged Back Volume
    6.
    发明申请
    Transducer with Enlarged Back Volume 有权
    带扩大背部音量的传感器

    公开(公告)号：US20140001580A1

    公开(公告)日：2014-01-02

    申请号：US13925076

    申请日：2013-06-24

    Applicant: Analog Devices, Inc.

    Inventor： David Bolognia ,  Kieran P. Harney

    IPC: B81C1/00 ,  B81B3/00 ,  B81B7/00

    CPC classification number: B81C1/00333 ,  B81B3/0094 ,  B81B7/0032 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/16152 ,  H04R19/005 ,  H04R2201/003 ,  H01L2924/00014

    Abstract: A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.

    Abstract translation: 封装集成器件包括具有第一表面和与第一表面相对的第二表面的封装衬底，并且封装衬底具有穿过其中的孔。 集成器件封装还包括安装在封装衬底的第一表面上以限定第一腔的第一盖和安装在封装衬底的第二表面上以限定第二腔的第二盖。 微机电系统（MEMS）管芯可以安装在封装衬底的第一表面的第一腔内和孔的上方。 可以在第一盖或第二盖中形成端口。

    FLEX-BASED SURFACE MOUNT TRANSFORMER
    7.
    发明申请
    FLEX-BASED SURFACE MOUNT TRANSFORMER 审中-公开

    公开(公告)号：US20170352469A1

    公开(公告)日：2017-12-07

    申请号：US15174477

    申请日：2016-06-06

    Applicant: Analog Devices, Inc.

    Inventor： David Bolognia ,  Vikram Venkatadri

    IPC: H01F27/28 ,  H01F41/10 ,  H01F41/04 ,  H05K3/30 ,  H01F27/29

    CPC classification number: H01F27/2804 ,  H01F5/00 ,  H01F27/2895 ,  H01F27/292 ,  H01F27/306 ,  H01F41/041 ,  H01F41/10 ,  H05K3/303

    Abstract: A transformer can include a flexible substrate having at least a first conductive layer and a dielectric layer. The transformer can further include an unbroken toroidal core of a magnetic material. The magnetic material can include material with a relative magnetic permeability greater than unity. The substrate can include a plurality of planar extensions arranged to provide respective windings encircling the core when the planar extensions are folded and attached back to another region of the substrate. Adjacent windings can be conductively isolated from each other. The flexible substrate can further include a second conductive layer separated from the first conductive layer by the dielectric layer. The first conductive layer and the second conductive layer can be coupled via a plurality of interconnects so that the respective windings are formed when the planar extensions are folded and attached back to the another region of the substrate.

    Compact sensor module
    9.
    发明授权
    Compact sensor module 有权
    紧凑型传感器模块

    公开(公告)号：US09116022B2

    公开(公告)日：2015-08-25

    申请号：US13708727

    申请日：2012-12-07

    Applicant: ANALOG DEVICES, INC.

    Inventor： David Bolognia

    IPC: H01L23/34 ,  G01D11/24 ,  H01L31/0203

    CPC classification number: H01L27/14634 ,  G01D11/245 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14661 ,  H01L31/0203 ,  H01L31/024 ,  Y10T29/49126

    Abstract: Various embodiments of a compact sensor module are disclosed herein. The sensor module can include a stiffener and a sensor substrate having a mounting segment and a first wing segment extending from the mounting segment. The first wing segment may be folded around an edge of the stiffener. A sensor die may be mounted on the mounting segment of the sensor substrate. A processor substrate may be coupled to the sensor substrate. A processor die may be mounted on the processor substrate and may be in electrical communication with the sensor die.

    Abstract translation: 本文公开了紧凑型传感器模块的各种实施例。 传感器模块可以包括加强件和具有安装段的传感器基板和从安装段延伸的第一翼段。 第一翼段可以围绕加强筋的边缘折叠。 传感器芯片可以安装在传感器基板的安装段上。 处理器基板可以耦合到传感器基板。 处理器管芯可以安装在处理器基板上并且可以与传感器管芯电连通。

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