Invention Grant
- Patent Title: Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
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Application No.: US14740190Application Date: 2015-06-15
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Publication No.: US09666553B2Publication Date: 2017-05-30
- Inventor: Rajen Manicon Murugan , Minhong Mi , Gary Paul Morrison , Jie Chen , Kenneth Robert Rhyner , Stanley Craig Beddingfield , Chittranjan Mohan Gupta , Django Earl Trombley
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Charles A. Brill; Frank D. Cimino
- Main IPC: H01Q1/00
- IPC: H01Q1/00 ; H01L23/00 ; H01L23/66 ; H01L23/498 ; H01Q1/22 ; H01Q23/00 ; H05K1/02
Abstract:
A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
Public/Granted literature
- US20150364816A1 MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS Public/Granted day:2015-12-17
Information query
