Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US14820564Application Date: 2015-08-07
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Publication No.: US09673303B2Publication Date: 2017-06-06
- Inventor: Cheol Kim , Donghyun Kim , Myeongcheol Kim , Daeyong Kim , Chulsung Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law PLLC
- Priority: KR10-2014-0102418 20140808
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/66 ; H01L21/768 ; H01L21/311

Abstract:
Provided are a semiconductor device and a fabrication method thereof. The semiconductor device may include a fin-shaped active pattern and a gate electrode provided on a substrate, first and second spacers provided on a sidewall of the gate electrode, impurity regions provided at both sides of the gate electrode, a contact plug electrically connected to one of the impurity regions, and a third spacer enclosing the contact plug and having a top surface positioned at substantially the same level as a top surface of the contact plug.
Public/Granted literature
- US20160043197A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2016-02-11
Information query
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