Anisotropically elongated thermoelectric material, process for preparing the same, and device comprising the material

Invention Grant

US09673371B2 Anisotropically elongated thermoelectric material, process for preparing the same, and device comprising the material 有权

Patent Title: Anisotropically elongated thermoelectric material, process for preparing the same, and device comprising the material
Application No.: US12539254

Application Date: 2009-08-11
Publication No.: US09673371B2

Publication Date: 2017-06-06
Inventor: Sang-mock Lee , Prabhakar Bandaru , Sung-ho Jin
Applicant: Sang-mock Lee , Prabhakar Bandaru , Sung-ho Jin
Applicant Address: KR Gyeonggi-Do US CA Oakland
Assignee: SAMSUNG ELECTRONICS CO., LTD.,THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Current Assignee Address: KR Gyeonggi-Do US CA Oakland
Agency: Cantor Colburn LLP
Main IPC: H01L35/14
IPC: H01L35/14 ; H01L35/34 ; B82Y30/00 ; C04B35/547 ; H01L35/22 ; H01L35/26

Abstract:

An anisotropically elongated thermoelectric nanocomposite includes a thermoelectric material.

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L35/00	包含有一个不同材料结点的热电器件，即显示出具有或不具有其他热电效应或其他热磁效应的Seebeck效应或Peltier效应的热电器件；专门适用于制造或处理这些热电器件或其部件的方法或设备；这些热电器件的零部件（由一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L35/12	.结点引出线材料的选择
H01L35/14	..应用无机合成物的