Invention Grant
- Patent Title: Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
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Application No.: US15200554Application Date: 2016-07-01
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Publication No.: US09691702B2Publication Date: 2017-06-27
- Inventor: Cyprian Emeka Uzoh , Charles G. Woychik , Arkalgud R. Sitaram , Hong Shen , Zhuowen Sun , Liang Wang , Guilian Gao
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/52 ; H01L21/44 ; H01L23/522 ; H01L49/02 ; H01L21/768 ; H01L21/8234
Abstract:
In a microelectronic component having conductive vias (114) passing through a substrate (104) and protruding above the substrate, conductive features (120E.A, 120E.B) are provided above the substrate that wrap around the conductive vias' protrusions (114′) to form capacitors, electromagnetic shields, and possibly other elements. Other features and embodiments are also provided.
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