Invention Grant
- Patent Title: Method for producing a conversion lamina and conversion lamina
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Application No.: US15053567Application Date: 2016-02-25
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Publication No.: US09691946B2Publication Date: 2017-06-27
- Inventor: Markus Richter
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102010049312 20101022
- Main IPC: H01L29/22
- IPC: H01L29/22 ; H01L33/50 ; H01L33/48 ; H01L21/48 ; H01L21/56 ; H01L33/44 ; H01L51/00
Abstract:
A method for producing at least one conversion lamina for a radiation-emitting semiconductor component is specified. A base material including a conversion substance contained therein is applied to a substrate by means of a double-layered stencil. Furthermore, a conversion lamina for a radiation-emitting semiconductor component includes a base material and a conversion substance embedded therein. The thickness of the conversion lamina is in a range of between 60 μm and 170 μm inclusive.
Public/Granted literature
- US20160181481A1 Method for Producing a Conversion Lamina and Conversion Lamina Public/Granted day:2016-06-23
Information query
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