Invention Grant
- Patent Title: Optical interconnect in high-speed memory systems
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Application No.: US15052161Application Date: 2016-02-24
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Publication No.: US09697883B2Publication Date: 2017-07-04
- Inventor: Jacob Baker , Brent Keeth
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H04B10/00
- IPC: H04B10/00 ; G11C11/4093 ; G06F13/16 ; G11C11/42 ; G06F13/28 ; G06F13/42 ; H04B10/80 ; H04L12/40 ; H04Q11/00
Abstract:
A optical link for achieving electrical isolation between a controller and a memory device is disclosed. The optical link increases the noise immunity of electrical interconnections, and allows the memory device to be placed a greater distance from the processor than is conventional without power-consuming I/O buffers.
Public/Granted literature
- US20160172020A1 OPTICAL INTERCONNECT IN HIGH-SPEED MEMORY SYSTEMS Public/Granted day:2016-06-16
Information query
