Invention Grant
- Patent Title: Storing container, storing container manufacturing method, semiconductor manufacturing method, and semiconductor manufacturing apparatus
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Application No.: US14434864Application Date: 2013-11-15
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Publication No.: US09704733B2Publication Date: 2017-07-11
- Inventor: Satoshi Torimi , Norihito Yabuki , Satoru Nogami
- Applicant: TOYO TANSO CO., LTD.
- Applicant Address: JP Osaka
- Assignee: TOYO TANSO CO., LTD.
- Current Assignee: TOYO TANSO CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-252754 20121116
- International Application: PCT/JP2013/006721 WO 20131115
- International Announcement: WO2014/076964 WO 20140522
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/673 ; C30B29/36 ; C30B33/12 ; H01L21/3065 ; H01L29/16 ; H01L21/67 ; C30B35/00 ; H01L21/04 ; H01L21/306 ; H01L21/302 ; C23C10/22 ; F27B17/00 ; C23C10/02

Abstract:
The present invention is to provide a storing container wherein Si does not drop onto a single crystal SiC substrate, and Si pressure distribution in an internal space can be made uniform. This storing container stores therein a single crystal SiC substrate to be etched by means of a heat treatment under Si vapor pressure. The storing container is formed of a tantalum metal, and has a tantalum carbide layer provided on an internal space side, and a tantalum silicide layer provided on the side further toward the internal space side than the tantalum carbide layer. The tantalum silicide layer supplies Si to the internal space. Furthermore, the tantalum silicide layer is different from adhered Si, and does not melt and drop.
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