Invention Grant
- Patent Title: Resin formulations, resin polymers and composite materials comprising the resin polymers
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Application No.: US14805094Application Date: 2015-07-21
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Publication No.: US09708437B2Publication Date: 2017-07-18
- Inventor: Kuei-Yi Chuang , Feng-Po Tseng , Kuo-Chan Chiou , Lu-Shih Liao
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW103140382A 20141121
- Main IPC: C08G18/38
- IPC: C08G18/38 ; C08K3/22 ; C08G18/34 ; C08K3/36 ; C08J5/04 ; C08G18/76

Abstract:
A resin formulation is provided. The resin formulation includes carboxy anhydride at 100 parts by weight, first diisocyanate having the following formula (I) at 20-90 parts by weight, second diisocyanate having the following formulas (II), (III) or a combination thereof at 45-103 parts by weight, and bismaleimide (BMI) at 50-200 parts by weight. A resin polymer and a composite material including the resin polymer are also provided. In formulas (I), (II) and (III), A includes benzene or cyclohexane, Q includes C1-C12 alkylene, —O—, —S— or —SO2—, X includes —H, —CH3 or —CH2CH3, R1 includes —H, —CH3 or —CH2CH3, and E includes —H, —CH3 or —CH2CH3.
Public/Granted literature
- US20160145373A1 RESIN FORMULATIONS, RESIN POLYMERS AND COMPOSITE MATERIALS COMPRISING THE RESIN POLYMERS Public/Granted day:2016-05-26
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