- Patent Title: Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition
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Application No.: US14633729Application Date: 2015-02-27
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Publication No.: US09709891B2Publication Date: 2017-07-18
- Inventor: Hiromi Kanda , Shinichi Kanna
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-356717 20051209; JP2006-107728 20060410; JP2006-196856 20060719
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/004 ; G03F7/075 ; G03F7/20 ; G03F7/30 ; G03F7/32 ; C07C69/653
Abstract:
A positive resist composition comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent; and a pattern forming method using the positive resist composition.
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