Invention Grant
- Patent Title: Light-emitting diode and manufacturing method therefor
-
Application No.: US14395631Application Date: 2013-03-19
-
Publication No.: US09728670B2Publication Date: 2017-08-08
- Inventor: Shaohua Huang , Jyh-Chiarng Wu
- Applicant: Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Xiamen
- Assignee: Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Current Assignee: Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Xiamen
- Agency: Syncoda LLC
- Agent Feng Ma; Junjie Feng
- Priority: CN201210119410 20120423
- International Application: PCT/CN2013/072861 WO 20130319
- International Announcement: WO2013/159614 WO 20131031
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/02 ; H01L33/12 ; H01L33/14

Abstract:
Disclosed is a light-emitting diode with an n-type graded buffer layer and a manufacturing method therefor. An epitaxial structure of a light-emitting diode comprises: a growth substrate; an n-type graded buffer layer located on the growth substrate; an n-type limiting layer (231) located on the n-type graded buffer layer; an active layer (232) located on the n-type limiting layer (231); and a p-type limiting layer (233) located on the active layer (232). A buffer layer is converted into an n-type graded buffer layer by means of an ion implantation method, and is applied to a light-emitting diode chip of a vertical structure while ensuring that a high-quality epitaxial structure is obtained, thereby being able to effectively reduce the contact resistance.
Public/Granted literature
- US20150084088A1 Light-Emitting Diode And Manufacturing Method Therefor Public/Granted day:2015-03-26
Information query
IPC分类: