Invention Grant
- Patent Title: Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same
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Application No.: US14554661Application Date: 2014-11-26
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Publication No.: US09731959B2Publication Date: 2017-08-15
- Inventor: Dipak Sengupta , Shafi Saiyed
- Applicant: ANALOG DEVICES, INC.
- Applicant Address: US MA Norwood
- Assignee: ANALOG DEVICES, INC.
- Current Assignee: ANALOG DEVICES, INC.
- Current Assignee Address: US MA Norwood
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00
Abstract:
An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die.
Public/Granted literature
- US20160090298A1 PACKAGES FOR STRESS-SENSITIVE DEVICE DIES Public/Granted day:2016-03-31
Information query
