公开(公告)号：US20220177298A1

公开(公告)日：2022-06-09

申请号：US17112894

申请日：2020-12-04

Applicant: Analog Devices, Inc.

Inventor： Yeonsung Kim ,  Shafi Saiyed ,  Thomas M. Goida

IPC: B81B7/00 ,  B81C1/00

Abstract: An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.

公开(公告)号：US08853839B2

公开(公告)日：2014-10-07

申请号：US13645094

申请日：2012-10-04

Applicant: Analog Devices, Inc.

Inventor： Jia Gao ,  Jicheng Yang ,  Shafi Saiyed ,  Siu Lung Ng ,  Xiaojie Xue

IPC: H01L23/495

CPC classification number: H01L29/84 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/032 ,  B81C2203/035 ,  H01L23/047 ,  H01L23/49861 ,  H01L29/66007 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2924/00

Abstract: A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

Abstract translation: 公开了一种用于包括空气释放机构的集成装置的壳体。 这在各种实施例中通过在封装衬底中形成通气孔并且在封装衬底上布置封装盖来实现。 通气孔允许空气从空腔包装内释放，从而确保包装盖保持稳定地固定到包装基板上，尽管加工过程中温度升高。 当将包装件安装到安装基板上时，通气孔可以被密封。

公开(公告)号：US20250118715A1

公开(公告)日：2025-04-10

申请号：US18730912

申请日：2023-01-24

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Jianglong Zhang ,  Li Chen ,  John C. Cowles ,  Michael Judy ,  Shafi Saiyed

IPC: H01L25/16 ,  B81B7/00 ,  H01L23/538

Abstract: Compact packages including microelectromechanical system (MEMS) devices and multiple application specific integrated circuits (ASICs) are described. These packages are sufficiently small to be applicable to contexts in which space requirements are particularly strict, such as in consumer electronics. These packages involve vertical die stacks. A first ASIC may be positioned on one side of the die stack and another ASIC may be positioned on the other side of the die stack. A die including a MEMS device (e.g., an accelerometer, gyroscope, switch, resonator, optical device) is positioned between the ASICs. Optionally, an interposer serving as cap substrate for the MEMS device is also positioned between the ASICs. In one example, a package of the types described herein has an extension of 2 mm×2 mm in the planar axes and less than 500-800 μm in height.

公开(公告)号：US20230234835A1

公开(公告)日：2023-07-27

申请号：US18100846

申请日：2023-01-24

Applicant: Analog Devices, Inc.

Inventor： Xin Zhang ,  Jianglong Zhang ,  Li Chen ,  John C. Cowles ,  Michael Judy ,  Shafi Saiyed

IPC: B81B7/00 ,  H01L23/00 ,  H01L23/498 ,  B81C1/00

CPC classification number: B81B7/0048 ,  H01L23/562 ,  H01L23/49827 ,  B81C1/00666

Abstract: Packaging of microfabricated devices, such as integrated circuits, microelectromechanical systems (MEMS), or sensor devices is described. The packaging is 3D heterogeneous packaging in at least some embodiments. The 3D heterogeneous packaging includes an interposer. The interposer includes stress relief platforms. Thus, stresses originating in the packaging do not propagate to the packaged device. A stress isolation platform is an example of a stress relief feature. A stress isolation platform includes a portion of an interposer coupled to the remainder of the interposer via stress isolation suspensions. Stress isolation suspensions can be formed by etching trenches through the interposer.

公开(公告)号：US09731959B2

公开(公告)日：2017-08-15

申请号：US14554661

申请日：2014-11-26

Applicant: ANALOG DEVICES, INC.

Inventor： Dipak Sengupta ,  Shafi Saiyed

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die.

公开(公告)号：US11702335B2

公开(公告)日：2023-07-18

申请号：US17112894

申请日：2020-12-04

Applicant: Analog Devices, Inc.

Inventor： Yeonsung Kim ,  Shafi Saiyed ,  Thomas M. Goida

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81B7/0048 ,  B81C1/0023 ,  B81B2207/015

Abstract: An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.

公开(公告)号：US20160090298A1

公开(公告)日：2016-03-31

申请号：US14554661

申请日：2014-11-26

Applicant: ANALOG DEVICES, INC.

Inventor： Dipak Sengupta ,  Shafi Saiyed

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die.

Abstract translation: 公开了一种集成器件封装。 该封装包括基板，该基板包括通过基板的顶表面的空腔。 第一集成器件管芯位于腔体中。 第一集成器件管芯包括一个或多个有源部件。 第二集成器件管芯附着到衬底的顶表面并且定位在腔体上。 第二集成器件管芯覆盖空腔。 封装剂可以覆盖第二个集成器件裸片。

公开(公告)号：US20130093031A1

公开(公告)日：2013-04-18

申请号：US13645094

申请日：2012-10-04

Applicant: Analog Devices, Inc.

Inventor： Jia Gao ,  Jicheng Yang ,  Shafi Saiyed ,  Siu Lung Ng ,  Xiaojie Xue

IPC: H01L29/84 ,  H01L29/66

CPC classification number: H01L29/84 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/032 ,  B81C2203/035 ,  H01L23/047 ,  H01L23/49861 ,  H01L29/66007 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2924/00

Abstract: A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

Abstract translation: 公开了一种用于包括空气释放机构的集成装置的壳体。 这在各种实施例中通过在封装衬底中形成通气孔并且在封装衬底上布置封装盖来实现。 通气孔允许空气从空腔包装内释放，从而确保包装盖保持稳定地固定到包装基板上，尽管加工过程中温度升高。 当将包装件安装到安装基板上时，通气孔可以被密封。