Invention Grant
- Patent Title: Semiconductor laser device assembly
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Application No.: US14623223Application Date: 2015-02-16
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Publication No.: US09735538B2Publication Date: 2017-08-15
- Inventor: Shunsuke Kono , Masaru Kuramoto , Takao Miyajima , Rintaro Koda , Hideki Watanabe
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP2014-028276 20140218
- Main IPC: H01S5/068
- IPC: H01S5/068 ; H01S5/00 ; H01S5/22 ; H01S5/343 ; H01S5/14 ; H01S3/08 ; H01S5/10
Abstract:
Disclosed is a semiconductor laser device assembly including a semiconductor laser device; and a dispersion compensation optical system, where a laser light exited from the semiconductor laser device is incident and exits to control a group velocity dispersion value of the laser light exited from the semiconductor laser device per wavelength.
Public/Granted literature
- US20150236474A1 SEMICONDUCTOR LASER DEVICE ASSEMBLY Public/Granted day:2015-08-20
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