Invention Grant
- Patent Title: Method for forming metal oxide semiconductor device
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Application No.: US15092623Application Date: 2016-04-07
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Publication No.: US09741830B2Publication Date: 2017-08-22
- Inventor: Kung-Hong Lee , Chun-Jung Tang , Te-Chih Chen , Tai-Ju Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201410709435 20141128
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/16 ; H01L29/161 ; H01L29/167 ; H01L29/24 ; H01L29/165

Abstract:
The present invention provides a method of forming a metal oxide semiconductor (MOS) device comprising a gate structure and an epitaxial structure. The gate structure is disposed on a substrate. The epitaxial structure is disposed in the substrate at two sides of the gate structure and a part thereof serves a source/drain of the MOS, wherein the epitaxial structure comprises: a first buffer layer with a second conductive type, a second buffer layer, and an epitaxial layer with a first conductive type complementary to the second conductive type. The present invention further provides a method of forming the same.
Public/Granted literature
- US20160225880A1 METHOD FOR FORMING METAL OXIDE SEMICONDUCTOR DEVICE Public/Granted day:2016-08-04
Information query
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