Invention Grant
- Patent Title: Vacuum integrated electronic device and manufacturing process thereof
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Application No.: US15150895Application Date: 2016-05-10
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Publication No.: US09754756B2Publication Date: 2017-09-05
- Inventor: Davide Giuseppe Patti , Myung Sung Kim
- Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS PTE LTD
- Applicant Address: IT Agrate Brianza SG Singapore
- Assignee: STMicroelectronics S.r.l.,STMicroelectronics Pte Ltd
- Current Assignee: STMicroelectronics S.r.l.,STMicroelectronics Pte Ltd
- Current Assignee Address: IT Agrate Brianza SG Singapore
- Agency: Seed IP Law Group LLP
- Priority: IT102015000075586 20151123
- Main IPC: H01J1/02
- IPC: H01J1/02 ; H01J19/02 ; H01J9/18 ; H01J21/20 ; H01J21/04
Abstract:
A vacuum integrated electronic device has an anode region of conductive material; an insulating region on top of the anode region; a cavity extending through the insulating region and having a sidewall; and a cathode region. The cathode region has a tip portion extending peripherally within the cavity, adjacent to the sidewall of the cavity. The cathode region is formed by tilted deposition, carried out at an angle of 30-60° with respect to a perpendicular to the surface of device.
Public/Granted literature
- US20170148604A1 VACUUM INTEGRATED ELECTRONIC DEVICE AND MANUFACTURING PROCESS THEREOF Public/Granted day:2017-05-25
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