Invention Grant
- Patent Title: Method of cutting substrate and method of manufacturing display apparatus
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Application No.: US14967090Application Date: 2015-12-11
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Publication No.: US09755192B2Publication Date: 2017-09-05
- Inventor: Junghwa You , Taeyong Kim , Hyojin Kim , Ilyoung Jeong , Gyoowan Han , Jekil Ryu , Jinho Lee
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR10-2015-0056892 20150422
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L51/56 ; B23K26/38 ; B23K26/0622 ; B23K26/18 ; B23K26/06 ; B23K26/40 ; B23K26/402 ; H01L51/52 ; B23K103/00

Abstract:
A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.
Public/Granted literature
- US20160315293A1 METHOD OF CUTTING SUBSTRATE AND METHOD OF MANUFACTURING DISPLAY APPARATUS Public/Granted day:2016-10-27
Information query
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