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公开(公告)号：US20230232696A1
公开(公告)日：2023-07-20
申请号：US18191135
申请日：2023-03-28
发明人： GEUNWOO YUG , Myeongseok Jeong , Soobum Park , Junghwa You , Ilyoung Jeong
CPC分类号： H10K71/00 , H10K50/86 , H10K59/12 , H10K59/40 , H10K71/80 , H10K77/111 , H10K59/1201 , H10K71/851 , H10K2102/311
摘要： A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.
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公开(公告)号：US11637270B2
公开(公告)日：2023-04-25
申请号：US17073726
申请日：2020-10-19
发明人： Geunwoo Yug , Myeongseok Jeong , Soobum Park , Junghwa You , Ilyoung Jeong
摘要： A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.
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公开(公告)号：US20210036267A1
公开(公告)日：2021-02-04
申请号：US17073726
申请日：2020-10-19
发明人： Geunwoo Yug , Myeongseok Jeong , Soobum Park , Junghwa You , Ilyoung Jeong
摘要： A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.
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公开(公告)号：US10811640B2
公开(公告)日：2020-10-20
申请号：US16164243
申请日：2018-10-18
发明人： Geunwoo Yug , Myeongseok Jeong , Soobum Park , Junghwa You , Ilyoung Jeong
摘要： A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.
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公开(公告)号：US20190259977A1
公开(公告)日：2019-08-22
申请号：US16164243
申请日：2018-10-18
发明人： Geunwoo Yug , Myeongseok Jeong , Soobum Park , Junghwa You , Ilyoung Jeong
摘要： A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.
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公开(公告)号：US11802078B2
公开(公告)日：2023-10-31
申请号：US17529736
申请日：2021-11-18
发明人： Alexander Voronov , Hyungsik Kim , Sunggyu Park , Junghwa You , Joongsung Lee , Woohyun Jung , Gyoowan Han
CPC分类号： C03C15/00 , C03C17/002 , C03C23/0025 , C03C2218/328 , C03C2218/355
摘要： A method of manufacturing a glass includes forming a first etch protection layer on a first surface of a glass substrate, and forming a second etch protection layer on a second surface of the glass substrate; removing a part of the first protection layer and a part of the second protection layer by applying a laser pulse penetrating the glass substrate from above the first surface of the glass substrate; forming a cut part in the glass substrate by etching the glass substrate using an etching solution; and removing the first etch protection layer and the second etch protection layer. The second surface is opposite to the first surface.
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公开(公告)号：US09755192B2
公开(公告)日：2017-09-05
申请号：US14967090
申请日：2015-12-11
发明人： Junghwa You , Taeyong Kim , Hyojin Kim , Ilyoung Jeong , Gyoowan Han , Jekil Ryu , Jinho Lee
IPC分类号： H01L21/00 , H01L51/56 , B23K26/38 , B23K26/0622 , B23K26/18 , B23K26/06 , B23K26/40 , B23K26/402 , H01L51/52 , B23K103/00
CPC分类号： H01L51/56 , B23K26/0608 , B23K26/0624 , B23K26/18 , B23K26/38 , B23K26/40 , B23K26/402 , B23K2103/00 , B23K2103/42 , B23K2103/50 , H01L51/5253 , H01L2251/566
摘要： A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.
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8.发明申请公开(公告)号：US20160315293A1
公开(公告)日：2016-10-27
申请号：US14967090
申请日：2015-12-11
发明人： Junghwa You , Taeyong Kim , Hyojin Kim , Ilyoung Jeong , Gyoowan Han , Jekil Ryu , Jinho Lee
IPC分类号： H01L51/56 , B23K26/18 , B23K26/0622 , H01L51/52 , B23K26/38
CPC分类号： H01L51/56 , B23K26/0608 , B23K26/0624 , B23K26/18 , B23K26/38 , B23K26/40 , B23K26/402 , B23K2103/00 , B23K2103/42 , B23K2103/50 , H01L51/5253 , H01L2251/566
摘要： A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.
摘要翻译： 切割基板的方法包括：在所述基板的第一表面上形成第一保护层; 通过用第一激光束照射所述第一保护层的所述第一保护层，形成除去所述第一保护层的一部分的去除区域; 以及在用所述第一激光束照射所述第一保护层之后，通过在所述去除区域处用第二激光束照射所述基板来去除所述基板的一部分而形成切割区域。
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