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公开(公告)号：US09755192B2
公开(公告)日：2017-09-05
申请号：US14967090
申请日：2015-12-11
发明人： Junghwa You , Taeyong Kim , Hyojin Kim , Ilyoung Jeong , Gyoowan Han , Jekil Ryu , Jinho Lee
IPC分类号： H01L21/00 , H01L51/56 , B23K26/38 , B23K26/0622 , B23K26/18 , B23K26/06 , B23K26/40 , B23K26/402 , H01L51/52 , B23K103/00
CPC分类号： H01L51/56 , B23K26/0608 , B23K26/0624 , B23K26/18 , B23K26/38 , B23K26/40 , B23K26/402 , B23K2103/00 , B23K2103/42 , B23K2103/50 , H01L51/5253 , H01L2251/566
摘要： A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.
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2.发明申请公开(公告)号：US20160315293A1
公开(公告)日：2016-10-27
申请号：US14967090
申请日：2015-12-11
发明人： Junghwa You , Taeyong Kim , Hyojin Kim , Ilyoung Jeong , Gyoowan Han , Jekil Ryu , Jinho Lee
IPC分类号： H01L51/56 , B23K26/18 , B23K26/0622 , H01L51/52 , B23K26/38
CPC分类号： H01L51/56 , B23K26/0608 , B23K26/0624 , B23K26/18 , B23K26/38 , B23K26/40 , B23K26/402 , B23K2103/00 , B23K2103/42 , B23K2103/50 , H01L51/5253 , H01L2251/566
摘要： A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.
摘要翻译： 切割基板的方法包括：在所述基板的第一表面上形成第一保护层; 通过用第一激光束照射所述第一保护层的所述第一保护层，形成除去所述第一保护层的一部分的去除区域; 以及在用所述第一激光束照射所述第一保护层之后，通过在所述去除区域处用第二激光束照射所述基板来去除所述基板的一部分而形成切割区域。
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公开(公告)号：US20170162832A1
公开(公告)日：2017-06-08
申请号：US15173008
申请日：2016-06-03
发明人： Jungsuk Hahn , Taeyong Kim , Jaeseok Park , Kyubum Kim , Jonghee Lim
IPC分类号： H01L51/56 , C23C16/458 , H01L51/00 , H01L21/677 , H01L21/683
CPC分类号： H01L51/56 , C23C14/042 , C23C14/12 , C23C14/24 , C23C14/568 , C23C16/4586 , H01L21/67706 , H01L21/6831 , H01L27/3244 , H01L51/001 , H01L2227/323
摘要： An organic layer deposition apparatus including: a conveying unit including a first conveying unit conveying in a first direction a moving unit to which a substrate is removably adhered, and a second conveying unit conveying in a direction opposite to the first direction the moving unit from which the substrate is separated, in which the moving unit may be cyclically conveyed by the first and second conveying units; and a deposition unit including a deposition assembly being separate from the substrate while the first conveying unit conveys the substrate adhered to the moving unit and having a material deposited onto the substrate, and a housing having the deposition assembly provided therein and an internal space allowing the moving unit to pass therethrough, in which the movable unit may include a main body unit, an electrostatic chuck provided on the main body unit and having the substrate adhered thereto, a contactless power supply (CPS) module provided facing with the electrostatic chuck each other on the main body unit, and a shield unit having at least a portion thereof provided on the main body unit with the CPS module thereon and preventing heat transfer.
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公开(公告)号：US09893322B2
公开(公告)日：2018-02-13
申请号：US15173008
申请日：2016-06-03
发明人： Jungsuk Hahn , Taeyong Kim , Jaeseok Park , Kyubum Kim , Jonghee Lim
IPC分类号： H01L51/56 , C23C16/458 , H01L21/677 , H01L21/683 , H01L51/00 , H01L27/32
CPC分类号： H01L51/56 , C23C14/042 , C23C14/12 , C23C14/24 , C23C14/568 , C23C16/4586 , H01L21/67706 , H01L21/6831 , H01L27/3244 , H01L51/001 , H01L2227/323
摘要： An organic layer deposition apparatus including: a conveying unit including a first conveying unit conveying in a first direction a moving unit to which a substrate is removably adhered, and a second conveying unit conveying in a direction opposite to the first direction the moving unit from which the substrate is separated, in which the moving unit may be cyclically conveyed by the first and second conveying units; and a deposition unit including a deposition assembly being separate from the substrate while the first conveying unit conveys the substrate adhered to the moving unit and having a material deposited onto the substrate, and a housing having the deposition assembly provided therein and an internal space allowing the moving unit to pass therethrough, in which the movable unit may include a main body unit, an electrostatic chuck provided on the main body unit and having the substrate adhered thereto, a contactless power supply (CPS) module provided facing with the electrostatic chuck each other on the main body unit, and a shield unit having at least a portion thereof provided on the main body unit with the CPS module thereon and preventing heat transfer.
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