Invention Grant
- Patent Title: Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
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Application No.: US14624702Application Date: 2015-02-18
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Publication No.: US09761475B2Publication Date: 2017-09-12
- Inventor: Naohide Takamoto , Goji Shiga , Fumiteru Asai
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-169556 20100728
- Main IPC: C09J7/02
- IPC: C09J7/02 ; H01L21/04 ; H01L21/683 ; H01L21/56 ; H01L23/29 ; H01L23/00 ; B32B37/12 ; B32B38/00 ; B32B38/10 ; H01L23/31 ; H01L23/544 ; C09J165/00
Abstract:
The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.
Public/Granted literature
Information query
