摘要:
A method of forming a structure for a downhole application comprises forming an interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone between opposing surfaces of a first substrate and a second substrate. A downhole structure and a downhole assembly are also described.
摘要:
A curable composition for bonding windings or core laminates in an electrical machine is presented. The curable composition includes: (A) about 10 weight percent to about 25 weight percent of a polyfunctional cyanate ester; (B) about 35 weight percent to about 65 weight percent of a first difunctional cyanate ester, or a prepolymer thereof; (C) about 15 weight percent to about 40 weight percent of a second difunctional cyanate ester, or a prepolymer thereof. An associated method is also presented.
摘要:
The invention discloses an adhesion agent composition comprising at least one C3-C200 olefin compound having at least one metathesis active double bond, wherein the olefin is substituted or unsubstituted; and at least one compatibilizing functionality for interacting with a substrate surface. The substrate surface can be any surface, for example, silicate glasses, silicate minerals, metals, metal alloys, ceramics, natural stones, plastics, carbon, silicon, and semiconductors. The invention also discloses articles of manufacture utilizing these adhesion agents as well as methods for adhering a polyolefin to a substrate surface.
摘要:
An object of the present invention is to provide a hot melt adhesive being environmentally-friendly, having excellent adhesion property to various substrates such as paper substrate and polyolefin substrate, as well having excellent thermal stability. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) an aliphatic polyester-based resin, (C) an olefin-based polymer, and (D) a tackifier resin.
摘要:
The pressure sensitive adhesive of the present invention includes an acryl-based base polymer and a hydrogenated terpene phenolic resin having a softening point of 70° C. to 150° C. The hydrogenated terpene phenolic resin preferably has a terpene molar ratio of 0.1 to 0.7. The content of acryl-based base polymer is preferably 45 to 95 parts by weight based on total 100 parts by weight of the pressure sensitive adhesive composition. In addition, total content of the acryl-based base polymer and the hydrogenated terpene phenolic resin is preferably 70 parts by weight or more. The pressure sensitive adhesive of the present invention is hardly clouded even under a high-temperature and high-humidity environment, and has level difference followability, thus can be used by disposing between a front transparent plate and a touch panel, between a front transparent plate and an image display panel or between a touch panel and an image display panel.
摘要:
An electronic device having, arranged in the following order, a cathodic layer, a conductive layer, a photoelectric conversion layer, and an anodic layer. The conductive layer contains a conductive adhesive composition which contains: (A) a water-soluble polyvinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound.
摘要:
The purpose of the present invention is to improve adhesion failure associated with “a bubble formation phenomenon” that may occur in an adhesive layer when the thickness of an adhesive agent is increased and “Cratering” which may be caused in the adhesive layer by contaminants or the like present on a material to be adhered.The purpose can be achieved by a powdery adhesive agent comprising thermosetting adhesive particles and a surface control agent, wherein the powdery adhesive agent contains the surface control agent in an amount of 0.1-5.0 parts by mass relative to 100 parts by mass of the thermosetting adhesive agent particle and used for the adhesion between a metal plate and a porous material.
摘要:
The present invention relates to a glass fiber binding composition having an effective binding amount of an aqueous compatible furan resin mixed with sufficient water to result in a binding composition having from 0.5 to 80% nonvolatile. The aqueous compatible furan resin is the reaction product of a source of ammonia and a first reaction product, the first reaction product being derived from the reaction of an acidic furan resin, a source of reactable formaldehyde, and a formaldehyde scavenger. The invention further pertains to a process of binding glass fibers at junctions of the fibers comprising the steps of providing glass fibers, applying an effect binding amount of the binding composition of the invention to the glass fibers such that the binder is present at a portion of the junctions, and curing the resin at the junctions of the glass fibers. Finally, the invention also discloses glass fiber compositions comprising a plurality of glass fibers having a plurality of junctions where two or more fibers meet, and an effective binding amount of the binding composition of the invention.
摘要:
A tackifier composition comprising, as essential compontents, (a) 100 parts by weight of a polyether having at least one reactive silicon group;(b) from 10 to 140 parts by weight of a phenolic hydroxyl group-containing cyclopentadiene resin which is obtained by copolymerization of 100 parts by weight of at least one component A selected from the group consisting of five-membered ring compounds of the following general formula having conjugated double bonds, and Diels-Alder reaction adducts thereof, ##STR1## in which H is a hydrogen atom, R is an alkyl group having from 1 to 3 carbon atoms, and m and n are each an integer of 0 or at least 1 provided that m+n=6, with 5 to 200 parts by weight of at least one component B selected from the group consisting of monohydric and polyhydric phenols and alkyl-substituted products thereof; and(c) from 0.1 to 10 parts by weight of a curing catalyst.
摘要翻译:一种增粘剂组合物,其包含作为必要组分的(a)100重量份的具有至少一个反应性硅基团的聚醚; (b)10〜140重量份含酚羟基的环戊二烯树脂,其通过共聚合100重量份的至少一种选自以下通式的五元环化合物的组分A 式中,H为氢原子,R为碳原子数1〜3的烷基,m和n分别为0以上或者0以下的整数。 至少1,条件是m + n = 6,具有5至200重量份的至少一种选自一元和多元酚及其烷基取代产物的组分B; 和(c)0.1-10重量份的固化催化剂。
摘要:
Resins suitable for adhesives are based on .alpha.-methyl styrene, styrene and phenol in certain percentages, viz. 25 to 63, 35 to 73 and 2 to 15 percent by weight, respectively.Combinations of resin, ethylene vinyl acetate copolymer, atactic polypropylene, ethyl acrylate copolymer or a thermoelastomer and optionally a wax or tackifying oil yield excellent adhesives, in particular hot-melt adhesives.