Invention Grant
- Patent Title: Photonic integrated circuit (PIC) and silicon photonics (SIP) circuitry device
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Application No.: US14689571Application Date: 2015-04-17
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Publication No.: US09784933B2Publication Date: 2017-10-10
- Inventor: John W. Osenbach , Timothy Butrie , Fred A. Kish, Jr. , Michael Reffle
- Applicant: Infinera Corporation
- Applicant Address: US CA Sunnyvale
- Assignee: Infinera Corporation
- Current Assignee: Infinera Corporation
- Current Assignee Address: US CA Sunnyvale
- Agent David L. Soltz
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G02B6/12 ; G02B6/13 ; G02B6/136

Abstract:
A device may include a first substrate. The device may include an optical source. The optical source may generate light when a voltage or current is applied to the optical source. The optical source may be being provided on a first region of the first substrate. The device may include a second substrate. A second region of the second substrate may form a cavity with the first region of the first substrate. The optical source may extend into the cavity. The device may include an optical interconnect. The optical interconnect may be provided on or in the second substrate and outside the cavity. The optical interconnect may be configured to receive the light from the optical source.
Public/Granted literature
- US20160178861A1 PHOTONIC INTEGRATED CIRCUIT (PIC) AND SILICON PHOTONICS (SIP) CIRCUITRY DEVICE Public/Granted day:2016-06-23
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