-
公开(公告)号：US10290619B2
公开(公告)日：2019-05-14
申请号：US15398713
申请日：2017-01-04
Applicant: Infinera Corporation
Inventor： Peter W. Evans , John W. Osenbach , Fred A. Kish, Jr. , Jiaming Zhang , Miguel Iglesias Olmedo , Maria Anagnosti
IPC: G02B6/00 , G02B6/12 , G02B6/42 , G02F1/21 , G02F1/225 , H01L23/00 , H01L25/18 , H01L31/02 , H04B10/40 , H04B10/50 , H01L23/498 , H01L23/538
Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.
-
公开(公告)号：US09312962B2
公开(公告)日：2016-04-12
申请号：US13675246
申请日：2012-11-13
Applicant: Infinera Corporation
Inventor： David J. Krause , Damien Lambert , Masaki Kato , Vikrant Lal , Radhakrishnan L. Nagarajan , Mehrdad Ziari , Fred A. Kish, Jr. , John D. McNicol , Han Henry Sun , Kuang-Tsan Wu
IPC: H04B10/50 , H04B10/516 , H04B10/54 , H04B10/548
CPC classification number: H04B10/5161 , H04B10/5051 , H04B10/5053 , H04B10/54 , H04B10/548
Abstract: An optical modulator includes a splitter, phase modulators, amplitude modulators, intensity modulators, and a combiner. The splitter is configured to receive light, and split the light into portions of the light. Each of the phase modulators is configured to receive a corresponding one of the portions of the light, and modulate a phase of the portion of the light to provide a phase-modulated signal. Each of the amplitude modulators is configured to receive a corresponding one of the phase-modulated signals, and modulate an amplitude of the phase-modulated signal to provide an amplitude-modulated signal. Each of the intensity modulators is configured to receive a corresponding one of the amplitude-modulated signals, and modulate an intensity of the amplitude-modulated signals to provide an intensity-modulated signal. The combiner is configured to receive the intensity-modulated signals, combine the intensity-modulated signals into a combined signal, and output the combined signal.
Abstract translation: 光调制器包括分路器，相位调制器，幅度调制器，强度调制器和组合器。 分离器被配置为接收光，并将光分解成光的一部分。 每个相位调制器被配置为接收光的对应的一部分，并调制该部分光的相位以提供相位调制信号。 每个幅度调制器被配置为接收对应的一个相位调制信号，并且调制相位调制信号的幅度以提供幅度调制信号。 每个强度调制器被配置为接收相应的幅度调制信号之一，并且调制幅度调制信号的强度以提供强度调制信号。 组合器被配置为接收强度调制信号，将强度调制信号组合成组合信号，并输出组合信号。
-
公开(公告)号：US10037982B2
公开(公告)日：2018-07-31
申请号：US15398704
申请日：2017-01-04
Applicant: Infinera Corporation
Inventor： Peter W. Evans , John W. Osenbach , Fred A. Kish, Jr. , Jiaming Zhang , Miguel Iglesias Olmedo , Maria Anagnosti
IPC: G02F1/035 , H01L25/18 , H01L23/498 , H01L23/00 , H01L31/02 , H01L23/538 , G02F1/225 , G02B6/12 , G02F1/21
Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes configured to receive the electrical signal, where at least one characteristics of a segment of the traveling wave active optical element is changed based on the electrical signal received by a corresponding electrode of the multiple electrodes; a ground electrode; and multiple bond contacts; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and multiple conductive vias electrically coupled to the conductive trace, where each conductive via of the multiple conductive vias is bonded with a respective bond contact of the multiple bond contacts of the photonic integrated circuit chip.
-
公开(公告)号：US12199405B2
公开(公告)日：2025-01-14
申请号：US15237635
申请日：2016-08-16
Applicant: Infinera Corporation
Inventor： Peter W. Evans , Fred A. Kish, Jr. , Vikrant Lal , Scott Corzine , Mingzhi Lu
IPC: H01S5/00 , H01S5/026 , H01S5/062 , H01S5/0625 , H01S5/068 , H01S5/10 , H01S5/14 , H01S5/20 , G02B6/12 , G02F1/21 , G02F1/225 , H01S3/107 , H01S5/22 , H01S5/30 , H01S5/40 , H04B10/572
Abstract: Consistent with the present disclosure, a compact laser with extended tunability (CLET) is provided that includes multiple segments or sections, at least one of which is curved, bent or non-collinear with other segments, so that the CLET has a compact form factor either as a singular laser or when integrated with other devices. The term CLET, as used herein, refers to any of the laser configurations disclosed herein having mirrors and a bent, angled or curved part, portion or section between such mirrors. If bent, the bent portion is preferably oriented at an angle of at least 30 degrees relative to other portions of the CLET. Alternatively, the curve or bend portion may be distributed over different sections of the CLET over a series of arcs, for example. The waveguide extending between the mirrors is continuous, such that light propagating along the waveguide is not divided or split. The waveguide also constitutes a continuous waveguide path.
-
公开(公告)号：US10211925B2
公开(公告)日：2019-02-19
申请号：US15849390
申请日：2017-12-20
Applicant: Infinera Corporation
Inventor： Timothy Butrie , Michael Reffle , Xiaofeng Han , Mehrdad Ziari , Vikrant Lal , Peter W. Evans , Fred A. Kish, Jr. , Donald J. Pavinski , Jie Tang , David Coult
Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.
-
Patent Agency Ranking
公开(公告)号：US10177531B2
公开(公告)日：2019-01-08
申请号：US15866127
申请日：2018-01-09
Applicant: Infinera Corporation
Inventor： Peter W. Evans , Mingzhi Lu , Fred A. Kish, Jr. , Vikrant Lal , Scott Corzine , John W. Osenbach , Jin Yan
IPC: H01S5/00 , H01S5/06 , H01S5/024 , H01S5/026 , H01S5/042 , H01S5/10 , H01S5/22 , H01S5/30 , G02B6/28 , H04B10/50 , H04B10/61 , G02F1/225 , H04B10/2507 , H04B10/40 , H04B10/67 , H01S5/0625 , H01S5/12 , H01S5/20 , H01S5/32
Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
-
公开(公告)号：US09784933B2
公开(公告)日：2017-10-10
申请号：US14689571
申请日：2015-04-17
Applicant: Infinera Corporation
Inventor： John W. Osenbach , Timothy Butrie , Fred A. Kish, Jr. , Michael Reffle
CPC classification number: G02B6/4251 , G02B6/12004 , G02B6/13 , G02B6/136 , G02B6/4215 , G02B6/4219 , G02B6/423 , G02B6/4257 , G02B6/4273 , G02B6/4274 , G02B2006/12035 , G02B2006/12061 , G02B2006/12078
Abstract: A device may include a first substrate. The device may include an optical source. The optical source may generate light when a voltage or current is applied to the optical source. The optical source may be being provided on a first region of the first substrate. The device may include a second substrate. A second region of the second substrate may form a cavity with the first region of the first substrate. The optical source may extend into the cavity. The device may include an optical interconnect. The optical interconnect may be provided on or in the second substrate and outside the cavity. The optical interconnect may be configured to receive the light from the optical source.
-
公开(公告)号：US10181698B2
公开(公告)日：2019-01-15
申请号：US15866138
申请日：2018-01-09
Applicant: Infinera Corporation
Inventor： Peter W. Evans , Mingzhi Lu , Fred A. Kish, Jr. , Vikrant Lal , Scott Corzine , John W. Osenbach , Jin Yan
IPC: H01S5/00 , H01S5/06 , H01S5/024 , H01S5/026 , H01S5/042 , H01S5/10 , H01S5/22 , H01S5/30 , G02B6/28 , H04B10/50 , H04B10/61 , G02F1/225 , H04B10/2507 , H04B10/40 , H04B10/67 , H01S5/0625 , H01S5/12 , H01S5/20 , H01S5/32
Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
-
公开(公告)号：US10122149B2
公开(公告)日：2018-11-06
申请号：US15398690
申请日：2017-01-04
Applicant: Infinera Corporation
Inventor： Peter W. Evans , Mingzhi Lu , Fred A. Kish, Jr. , Vikrant Lal , Scott Corzine , John W. Osenbach , Jin Yan
Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
-
公开(公告)号：US09876575B2
公开(公告)日：2018-01-23
申请号：US14699907
申请日：2015-04-29
Applicant: Infinera Corporation
Inventor： Timothy Butrie , Michael Reffle , Xiaofeng Han , Mehrdad Ziari , Vikrant Lal , Peter W. Evans , Fred A. Kish, Jr. , Donald J. Pavinski , Jie Tang , David Coult
CPC classification number: H04B10/40 , G02B6/3584 , G02B6/3598 , G02B6/366 , G02B6/4204 , G02B6/4215 , G02B6/4234 , G02B6/4246 , H04B10/503 , H04J14/06
Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.
-
-
-
-
-
-
-
-
-
Search Results
14
records
(took 0.012 seconds)
