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    OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO
    1.
    发明申请
    OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO 审中-公开

    公开(公告)号：US20190089475A1

    公开(公告)日：2019-03-21

    申请号：US16191974

    申请日：2018-11-15

    Applicant: Infinera Corporation

    Inventor： Fred A. Kish, JR. ,  Michael Reffle ,  Jeffrey T. Rahn ,  John Osenbach ,  Timothy Butrie ,  Xiaofeng Han ,  Mark Missey ,  Mehrdad Ziari ,  Peter W. Evans

    IPC: H04J14/02 ,  H04B10/50 ,  H04B10/079

    Abstract: Consistent with the present disclosure, a photonic integrated circuit (PIC) is provided that has 2 N channels (N being an integer). The PIC is optically coupled to N optical fibers, such that each of N polarization multiplexed optical signals are transmitted over a respective one of the N optical fibers. In another example, each of the N optical fibers supply a respective one of N polarization multiplexed optical signals to the PIC for coherent detection and processing. A multiplexer and demultiplexer may be omitted from the PIC, such that the optical signals are not combined on the PIC. As a result, the transmitted and received optical signals incur less loss and amplified spontaneous emission (ASE) noise. In addition, optical taps may be more readily employed on the PIC to measure outputs of the lasers, such as widely tunable lasers (WTLs), without crossing waveguides.

    OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO
    3.
    发明申请
    OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO 审中-公开

    公开(公告)号：US20190089476A1

    公开(公告)日：2019-03-21

    申请号：US16192032

    申请日：2018-11-15

    Applicant: Infinera Corporation

    Inventor： Fred A. Kish, JR. ,  Michael Reffle ,  Jeffrey T. Rahn ,  John Osenbach ,  Timothy Butrie ,  Xiaofeng Han ,  Mark Missey ,  Mehrdad Ziari ,  Peter w. Evans

    IPC: H04J14/02 ,  H04B10/50 ,  H04B10/079

    Abstract: Consistent with the present disclosure, a photonic integrated circuit (PIC) is provided that has 2 N channels (N being an integer). The PIC is optically coupled to N optical fibers, such that each of N polarization multiplexed optical signals are transmitted over a respective one of the N optical fibers. In another example, each of the N optical fibers supply a respective one of N polarization multiplexed optical signals to the PIC for coherent detection and processing. A multiplexer and demultiplexer may be omitted from the PIC, such that the optical signals are not combined on the PIC. As a result, the transmitted and received optical signals incur less loss and amplified spontaneous emission (ASE) noise. In addition, optical taps may be more readily employed on the PIC to measure outputs of the lasers, such as widely tunable lasers (WTLs), without crossing waveguides.

    PHOTONIC INTEGRATED CIRCUIT (PIC) AND SILICON PHOTONICS (SIP) CIRCUITRY DEVICE
    4.
    发明申请
    PHOTONIC INTEGRATED CIRCUIT (PIC) AND SILICON PHOTONICS (SIP) CIRCUITRY DEVICE 有权
    光电集成电路（PIC）和硅光电（SIP）电路设备

    公开(公告)号：US20160178861A1

    公开(公告)日：2016-06-23

    申请号：US14689571

    申请日：2015-04-17

    Applicant: Infinera Corporation

    Inventor： John W. OSENBACH ,  Timothy Butrie ,  Fred A. Kish, JR. ,  Michael Reffle

    IPC: G02B6/42 ,  G02B6/13 ,  G02B6/12

    CPC classification number: G02B6/4251 ,  G02B6/12004 ,  G02B6/13 ,  G02B6/136 ,  G02B6/4215 ,  G02B6/4219 ,  G02B6/423 ,  G02B6/4257 ,  G02B6/4273 ,  G02B6/4274 ,  G02B2006/12035 ,  G02B2006/12061 ,  G02B2006/12078

    Abstract: A device may include a first substrate. The device may include an optical source. The optical source may generate light when a voltage or current is applied to the optical source. The optical source may be being provided on a first region of the first substrate. The device may include a second substrate. A second region of the second substrate may form a cavity with the first region of the first substrate. The optical source may extend into the cavity. The device may include an optical interconnect. The optical interconnect may be provided on or in the second substrate and outside the cavity. The optical interconnect may be configured to receive the light from the optical source.

    Abstract translation: 器件可以包括第一衬底。 该装置可以包括光源。 当向光源施加电压或电流时，光源可以产生光。 光源可以设置在第一基板的第一区域上。 该装置可以包括第二基板。 第二基板的第二区域可以与第一基板的第一区域形成空腔。 光源可以延伸到空腔中。 该装置可以包括光学互连。 光学互连可以设置在第二基板上或第二基板中并且在空腔外部。 光学互连可以被配置为接收来自光源的光。

    SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTEGRATED CIRCUIT MODULES AND SYSTEMS
    6.
    发明申请
    SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTEGRATED CIRCUIT MODULES AND SYSTEMS 审中-公开

    公开(公告)号：US20190342009A1

    公开(公告)日：2019-11-07

    申请号：US15973266

    申请日：2018-05-07

    Applicant: Infinera Corporation

    Inventor： Peter W. Evans ,  Fred A. Kish, JR. ,  Vikrant Lal ,  Jacco Ploumeekers ,  Timothy Butrie ,  David G. Coult ,  John W. Osenbach ,  Jie Tang ,  Jiaming Zhang

    IPC: H04B10/80 ,  G02B6/42 ,  H04B10/50

    Abstract: Consistent with the present disclosure, one or more spare Widely Tunable Lasers (WTLs) are integrated on a PIC. In the event that a channel, including, for example, a laser, a modulator and a semiconductor optical amplifier in a transmitter or Tx PIC, or a laser, optical hybrid, and photodiodes, for example, in a receiver PIC (Rx PIC), includes one or more defective devices, a spare channel is selected that includes a widely tunable laser (WTL) which may be tuned to the wavelength associated with any of the channels on the PIC. Accordingly, the spare channel replaces the defective channel or the lowest performing channel and outputs modulated optical signals at the wavelength associated with the defective channel. Thus, even though a defective channel may be present, a die consistent with the present disclosure may still output or receive the desired channels because the spare channel replaces the defective channel. As a result, yields and minimum performance may improve compared to PICs that do not have a spare channel and manufacturing costs may be reduced. Alternatively, connections, such as fiber connections, may be made only to the operation or best performing channels.

    INTERPOSER ON CARRIER INTEGRATED CIRCUIT MOUNT
    7.
    发明申请
    INTERPOSER ON CARRIER INTEGRATED CIRCUIT MOUNT 审中-公开

    公开(公告)号：US20190341359A1

    公开(公告)日：2019-11-07

    申请号：US16297835

    申请日：2019-03-11

    Applicant: Infinera Corporation

    Inventor： Jie Tang ,  Jiaming Zhang ,  Timothy Butrie ,  John W. Osenbach ,  Fred Kish, JR.

    IPC: H01L23/00 ,  H01L23/16 ,  H01L23/538

    Abstract: Consistent with the present disclosure, the back side of a chip is attached to a lid structure. Legs are attached or integrated monolithically to the lid such that the legs are provided in and around the periphery of the lid and are designed in such a way as to not interfere with the optical output/input (facet) of the PIC, for example, by not putting the leg or a portion of the leg in front of the optical output/input region of the PIGC. Since the lid, to which the chip is attached, is secured to the substrate, the electrical connections between the chip and the substrate are also subject to little, if any, mechanical stress, thereby obviating the need for the underfill. Accordingly, electrical traces on the chip and the substrate do not contact a high dielectric constant material, and, as a result, impedance and loss may be reduced. Moreover, optical devices, if integrated on the chip as in a PIC, are not subject to stresses caused by underfill so that the optical properties of such devices may be preserved.

    HYBRID OPTICAL TRANSMITTER AND/OR RECEIVER STRUCTURE
    8.
    发明申请
    HYBRID OPTICAL TRANSMITTER AND/OR RECEIVER STRUCTURE 审中-公开

    公开(公告)号：US20190158183A1

    公开(公告)日：2019-05-23

    申请号：US16241625

    申请日：2019-01-07

    Applicant: Infinera Corporation

    Inventor： Timothy Butrie ,  Michael Reffle ,  Xiaofeng Han ,  Mehrdad Ziari ,  Vikrant Lal ,  Peter W. Evans ,  Fred A. Klsh ,  Donald J. Pavinski ,  Jie Tang ,  David Coult

    IPC: H04B10/40 ,  H04B10/50 ,  H04J14/06 ,  G02B6/42

    Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

    HYBRID OPTICAL TRANSMITTER AND/OR RECEIVER STRUCTURE
    9.
    发明申请
    HYBRID OPTICAL TRANSMITTER AND/OR RECEIVER STRUCTURE 有权
    混合光学发射器和/或接收器结构

    公开(公告)号：US20150318952A1

    公开(公告)日：2015-11-05

    申请号：US14699907

    申请日：2015-04-29

    Applicant: Infinera Corporation

    Inventor： Timothy Butrie ,  Michael Reffle ,  Xiaofeng Han ,  Mehrdad Ziari ,  Vikrant Lal ,  Peter W. Evans ,  Fred A. Kish, JR. ,  Donald J. Pavinski ,  Jie Tang ,  David Coult

    IPC: H04J14/06 ,  H04B10/40 ,  H04B10/50

    CPC classification number: H04B10/40 ,  G02B6/3584 ,  G02B6/3598 ,  G02B6/366 ,  G02B6/4204 ,  G02B6/4215 ,  G02B6/4234 ,  G02B6/4246 ,  H04B10/503 ,  H04J14/06

    Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

    Abstract translation: 器件可以包括衬底。 该装置可以包括安装到基板的载体。 该装置可以包括安装在载体上的发射器光子集成电路（PIC）。 发射器PIC可以包括当电压或电流施加到多个激光器之一时产生光信号的多个激光器。 该器件可以包括安装到衬底的第一微机电结构（MEMS）。 第一MEMS可以包括第一组透镜。 该装置可以包括安装到基板的平面光波电路（PLC）。 PLC可以由第一MEMS的第一组透镜光耦合到多个激光器。 该装置可以包括安装到基板的第二MEMS，其可以包括第二组透镜，其可被配置为将PLC光耦合到光纤。

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