Invention Grant
- Patent Title: Method for evaluating semiconductor film and method for manufacturing semiconductor device
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Application No.: US14855648Application Date: 2015-09-16
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Publication No.: US09786495B2Publication Date: 2017-10-10
- Inventor: Akihisa Shimomura , Naoki Okuno , Mitsuhiro Ichijo , Noriyoshi Suzuki , Tetsuhiro Tanaka , Sachiaki Tezuka
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2014-191058 20140919
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/66 ; H01J37/32 ; C23C14/08 ; C23C14/58

Abstract:
A method for evaluating a semiconductor film of a semiconductor device which is configured to include an insulating film, the semiconductor film, and a conductive film and to have a region where the semiconductor film and the conductive film overlap with each other with the insulating film provided therebetween, includes a step of performing plasma treatment after formation of the insulating film, and a step of calculating a peak value of resistivity of a microwave in the semiconductor film by a microwave photoconductive decay method after the plasma treatment, so that the hydrogen concentration in the semiconductor film is estimated.
Public/Granted literature
- US20160086792A1 METHOD FOR EVALUATING SEMICONDUCTOR FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2016-03-24
Information query
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