Invention Grant
- Patent Title: Semiconductor package
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Application No.: US13277575Application Date: 2011-10-20
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Publication No.: US09786622B2Publication Date: 2017-10-10
- Inventor: Ming-Da Cheng , Chih-Wei Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chun-Cheng Lin , Chung-Shi Liu
- Applicant: Ming-Da Cheng , Chih-Wei Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chun-Cheng Lin , Chung-Shi Liu
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L23/00
Abstract:
A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The distance between the conductive pillar and the conductive trace is less than or equal to about 16 μm.
Public/Granted literature
- US20130099370A1 SEMICONDUCTOR PACKAGE Public/Granted day:2013-04-25
Information query
IPC分类:
