专利检索 ap:("Ming-Da Cheng" OR "Chih-Wei Lin" OR "Kuei-Wei Huang" OR "Yu-Peng Tsai" OR "Chun-Cheng Lin" OR "Chung-Shi Liu") AND inv:"Ming-Da Cheng" 第 1 页

1.

发明申请
Packaging Methods and Structures for Semiconductor Devices 有权

公开(公告)号：US20130062761A1

公开(公告)日：2013-03-14

申请号：US13228768

申请日：2011-09-09

申请人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin

发明人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin

IPC分类号： H01L23/498 , H01L21/56

CPC分类号： H01L25/0657 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2221/68331 , H01L2221/68345 , H01L2221/68377 , H01L2224/0231 , H01L2224/0401 , H01L2224/04105 , H01L2224/06515 , H01L2224/09181 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/73259 , H01L2224/81005 , H01L2224/81191 , H01L2224/81815 , H01L2224/9202 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06548 , H01L2924/14 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15322 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2224/81 , H01L2224/03 , H01L2924/014 , H01L2924/00

摘要： Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.

2.

发明授权
Semiconductor package 有权

公开(公告)号：US09786622B2

公开(公告)日：2017-10-10

申请号：US13277575

申请日：2011-10-20

申请人： Ming-Da Cheng , Chih-Wei Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chun-Cheng Lin , Chung-Shi Liu

发明人： Ming-Da Cheng , Chih-Wei Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chun-Cheng Lin , Chung-Shi Liu

IPC分类号： H01L23/488 , H01L23/00

CPC分类号： H01L24/16 , H01L24/13 , H01L24/81 , H01L2224/05572 , H01L2224/1146 , H01L2224/11849 , H01L2224/13005 , H01L2224/13012 , H01L2224/13014 , H01L2224/1308 , H01L2224/13082 , H01L2224/1601 , H01L2224/16104 , H01L2224/16238 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/8191 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/206 , H01L2924/00014 , H01L2924/00012 , H01L2924/00

摘要： A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The distance between the conductive pillar and the conductive trace is less than or equal to about 16 μm.

3.

发明授权
Packaging methods and structures for semiconductor devices 有权
标题翻译：半导体器件的封装方法和结构

公开(公告)号：US08884431B2

公开(公告)日：2014-11-11

申请号：US13228768

申请日：2011-09-09

申请人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin

发明人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin

IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L21/683 , H01L23/498 , H01L21/56 , H01L25/065 , H01L23/538 , H01L25/00 , H01L23/00 , H01L23/31 , H01L25/10 , H01L25/03 , H01L21/768

CPC分类号： H01L25/0657 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2221/68331 , H01L2221/68345 , H01L2221/68377 , H01L2224/0231 , H01L2224/0401 , H01L2224/04105 , H01L2224/06515 , H01L2224/09181 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/73259 , H01L2224/81005 , H01L2224/81191 , H01L2224/81815 , H01L2224/9202 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06548 , H01L2924/14 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15322 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2224/81 , H01L2224/03 , H01L2924/014 , H01L2924/00

摘要： Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.

摘要翻译： 公开了用于半导体器件的封装方法和结构。在一个实施例中，封装的半导体器件包括具有第一表面和与第一表面相对的第二表面的再分配层（RDL）。至少一个集成电路耦合到RDL的第一表面，并且多个金属凸块耦合到RDL的第二表面。模制化合物设置在RDL的至少一个集成电路和第一表面上。

4.

发明申请
Package-on-Package Process for Applying Molding Compound 有权
标题翻译：包装成型包装方法

公开(公告)号：US20120299181A1

公开(公告)日：2012-11-29

申请号：US13118108

申请日：2011-05-27

申请人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu

发明人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu

IPC分类号： H01L23/488 , H01L21/56

CPC分类号： H01L24/17 , H01L21/565 , H01L21/566 , H01L23/3114 , H01L23/3128 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16055 , H01L2224/16113 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/1023 , H01L2225/1058 , H01L2924/01029 , H01L2924/014 , H01L2924/12042 , H01L2924/1304 , H01L2924/14 , H01L2924/1432 , H01L2924/1434 , H01L2924/15174 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/00

摘要： A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.

摘要翻译： 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。

5.

发明授权
Package-on-package process for applying molding compound 有权
标题翻译：封装包装方法，适用于模塑料

公开(公告)号：US08927391B2

公开(公告)日：2015-01-06

申请号：US13118108

申请日：2011-05-27

申请人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu

发明人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu

IPC分类号： H01L21/30 , H01L21/56 , H01L25/00 , H01L25/10 , H01L23/00 , H01L23/31 , H01L23/498

CPC分类号： H01L24/17 , H01L21/565 , H01L21/566 , H01L23/3114 , H01L23/3128 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16055 , H01L2224/16113 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/1023 , H01L2225/1058 , H01L2924/01029 , H01L2924/014 , H01L2924/12042 , H01L2924/1304 , H01L2924/14 , H01L2924/1432 , H01L2924/1434 , H01L2924/15174 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/00

摘要： A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.

摘要翻译： 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。

6.

发明授权
Methods for forming 3DIC package 有权

公开(公告)号：US08609462B2

公开(公告)日：2013-12-17

申请号：US13272032

申请日：2011-10-12

申请人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu

发明人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu

IPC分类号： H01L21/44

CPC分类号： B23Q3/18 , H01L21/50 , H01L21/561 , H01L21/563 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75733 , H01L2224/75744 , H01L2224/75754 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2224/83104 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/97 , H01L2924/3511 , Y10T29/41 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2924/00012 , H01L2924/014

摘要： A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.

7.

发明申请
Methods for Forming 3DIC Package 有权
标题翻译：形成3DIC包的方法

公开(公告)号：US20130095608A1

公开(公告)日：2013-04-18

申请号：US13272032

申请日：2011-10-12

申请人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu

发明人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu

IPC分类号： H01L21/50 , H01L21/00

CPC分类号： B23Q3/18 , H01L21/50 , H01L21/561 , H01L21/563 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75733 , H01L2224/75744 , H01L2224/75754 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2224/83104 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/97 , H01L2924/3511 , Y10T29/41 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2924/00012 , H01L2924/014

摘要： A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.

摘要翻译： 一种方法包括在第一包装部件和第二包装部件之间分配底部填充物，其中第一包装部件被放置在下部夹具上，并且第二包装部件结合到第一包装部件上。通孔位于下夹具中并在第一包装部件下方。底部填充物被固化，其中在固化底部填充物的步骤期间，施加力以使第一包装部件变平。通过执行从通过通孔的抽真空和空气吹扫的组中选择的动作来施加力。

8.

发明申请
Packaging Methods for Semiconductor Devices 审中-公开
标题翻译：半导体器件的封装方法

公开(公告)号：US20130095611A1

公开(公告)日：2013-04-18

申请号：US13276143

申请日：2011-10-18

申请人： Kuei-Wei Huang , Wei-Hung Lin , Chih-Wei Lin , Chun-Cheng Lin , Meng-Tse Chen , Ming-Da Cheng , Chung-Shi Liu

发明人： Kuei-Wei Huang , Wei-Hung Lin , Chih-Wei Lin , Chun-Cheng Lin , Meng-Tse Chen , Ming-Da Cheng , Chung-Shi Liu

IPC分类号： H01L21/56

摘要： Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.

摘要翻译： 公开了半导体器件的封装方法。在一个实施例中，封装半导体器件的方法包括提供包括多个封装衬底的工件。在多个包装基板之间移除一部分工件。模具附接到多个封装基板中的每一个。