Invention Grant
- Patent Title: Solder material and bonded structure
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Application No.: US14920772Application Date: 2015-10-22
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Publication No.: US09789569B2Publication Date: 2017-10-17
- Inventor: Akio Furusawa , Kiyohiro Hine , Masato Mori , Taichi Nakamura
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Managment Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Managment Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Panasonic IP Management
- Agent Kerry S. Culpepper
- Priority: JP2013-245191 20131127
- Main IPC: H05K1/11
- IPC: H05K1/11 ; B23K35/26 ; B23K35/40 ; B23K35/02 ; H05K3/34 ; C22C13/00 ; H05K1/18 ; H05K3/24
Abstract:
Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0
Public/Granted literature
- US20160039052A1 SOLDER MATERIAL AND BONDED STRUCTURE Public/Granted day:2016-02-11
Information query
