Invention Grant
- Patent Title: Liquid processing method, liquid processing apparatus and recording medium
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Application No.: US14963831Application Date: 2015-12-09
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Publication No.: US09791778B2Publication Date: 2017-10-17
- Inventor: Takafumi Hasimoto , Shinichi Hatakeyama , Naoki Shibata
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2015-006032 20150115
- Main IPC: G03B27/32
- IPC: G03B27/32 ; G03F7/16

Abstract:
There are provided a liquid processing method, a liquid processing apparatus and a recording medium for liquid processing which can enhance the uniformity of the coating state of a processing liquid on a substrate. A coating unit includes a rotary holder for rotating a wafer, a nozzle for supplying a processing liquid onto a surface of the wafer, and a controller for controlling the position of the nozzle with respect to the wafer. A liquid processing method includes: starting the supply of the processing liquid to the surface of the wafer at an eccentric position at a distance from the center of rotation of the wafer, and moving the position on the wafer to which the processing liquid is supplied toward the center of rotation of the wafer while rotating the wafer at a first rotational speed; and, after the processing liquid supply position has reached the center of rotation of the wafer, rotating the wafer at a second rotational speed which is higher than the first rotational speed, thereby allowing the processing liquid to spread toward the periphery of the wafer.
Public/Granted literature
- US20160209748A1 LIQUID PROCESSING METHOD, LIQUID PROCESSING APPARATUS AND RECORDING MEDIUM Public/Granted day:2016-07-21
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