公开(公告)号：US09791778B2

公开(公告)日：2017-10-17

申请号：US14963831

申请日：2015-12-09

Applicant: Tokyo Electron Limited

Inventor： Takafumi Hasimoto ,  Shinichi Hatakeyama ,  Naoki Shibata

IPC: G03B27/32 ,  G03F7/16

CPC classification number: G03F7/16

Abstract: There are provided a liquid processing method, a liquid processing apparatus and a recording medium for liquid processing which can enhance the uniformity of the coating state of a processing liquid on a substrate. A coating unit includes a rotary holder for rotating a wafer, a nozzle for supplying a processing liquid onto a surface of the wafer, and a controller for controlling the position of the nozzle with respect to the wafer. A liquid processing method includes: starting the supply of the processing liquid to the surface of the wafer at an eccentric position at a distance from the center of rotation of the wafer, and moving the position on the wafer to which the processing liquid is supplied toward the center of rotation of the wafer while rotating the wafer at a first rotational speed; and, after the processing liquid supply position has reached the center of rotation of the wafer, rotating the wafer at a second rotational speed which is higher than the first rotational speed, thereby allowing the processing liquid to spread toward the periphery of the wafer.

公开(公告)号：US11062899B2

公开(公告)日：2021-07-13

申请号：US15876283

申请日：2018-01-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takafumi Hasimoto ,  Masahide Tadokoro ,  Taku Nagakane ,  Koji Takayanagi

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/687 ,  B08B3/08 ,  B08B3/04 ,  G03F7/40 ,  G03F7/16

Abstract: There is provided a coated film removing apparatus for removing, with a removal liquid, a peripheral portion of a coated film formed by supplying a coating liquid to a surface of a circular substrate, including: a rotary holding part configured to hold the substrate and rotate together with the substrate; a removal liquid nozzle configured to discharge the removal liquid on a peripheral portion of the surface of the substrate held by the rotary holding part so that the removal liquid is oriented toward a downstream side in a rotational direction of the substrate; and a control part configured to output a control signal so as to rotate the substrate at a rotation speed of 2,300 rpm or more when discharging the removal liquid.

公开(公告)号：US10048664B2

公开(公告)日：2018-08-14

申请号：US14963802

申请日：2015-12-09

Applicant: Tokyo Electron Limited

Inventor： Takafumi Hasimoto ,  Shinichi Hatakeyama ,  Naoki Shibata ,  Kousuke Yoshihara ,  Minoru Kubota ,  Hiroyuki Ide

IPC: B05C5/00 ,  G05B15/02 ,  H01L21/02 ,  B05C13/02 ,  B05B1/00 ,  B05D1/00 ,  G03F7/16 ,  H01L21/67 ,  B05D3/04 ,  B05D3/10

Abstract: There is provided a coating method which can apply a coating solution uniformly onto a substrate surface while reducing the amount of the coating solution supplied. The coating method for applying a coating solution onto a wafer includes the steps of: supplying a solvent for the coating solution onto the wafer to form an annular liquid film of the solvent in a peripheral area of the wafer; supplying the coating solution to the center of the wafer while rotating the wafer at a first rotational speed (time t1-t2); and allowing the coating solution to spread on the wafer by rotating the wafer at a second rotational speed which is higher than the first rotational speed (time t4-t5). The supply of the solvent is continued until just before the coating solution comes into contact with the liquid film of the solvent (time t0-t3).