Invention Grant
- Patent Title: Single crystal alumina filled die attach paste
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Application No.: US15255229Application Date: 2016-09-02
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Publication No.: US09796898B2Publication Date: 2017-10-24
- Inventor: Long Fang , Wangsheng Fang , Wei Yao
- Applicant: Henkel AG & Co. KGaA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO. KGAA
- Current Assignee: HENKEL AG & CO. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent James J. Cummings
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C08K3/22 ; C08L83/04 ; C08K5/05 ; C08K7/00 ; C09J183/04 ; C08G77/12 ; C08G77/20
Abstract:
A die attach paste composition comprising (a) an organosilicone resin; (b) a single crystal alumina filler; (c) a hardener; and (d) an inhibitor. By using single crystal alumina filler in a silicone based die attach paste, thermal conductivity and anti-yellowing properties are improved in comparison with other spherical alumina particles at the same filler loading content.
Public/Granted literature
- US20160369150A1 SINGLE CRYSTAL ALUMINA FILLED DIE ATTACH PASTE Public/Granted day:2016-12-22
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