Invention Grant
- Patent Title: LED chip package
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Application No.: US15162538Application Date: 2016-05-23
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Publication No.: US09812432B2Publication Date: 2017-11-07
- Inventor: Yi-Jyun Chen , Chih-Hao Lin
- Applicant: LEXTAR ELECTRONICS CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: Lextar Electronics Corporation
- Current Assignee: Lextar Electronics Corporation
- Current Assignee Address: TW Hsinchu
- Priority: TW104131094A 20150921
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/08 ; H01L33/62 ; H01L33/60 ; H01L33/50 ; H01L27/15
Abstract:
An LED chip package includes a substrate having a metal terminal (gold finger structure). A LED chip set is composed of a plurality of LED chips formed in one piece, and has a plurality of light-emitting areas which are separated from each other. The LED chip set is disposed on the substrate and electrically connected to the metal terminal.
Public/Granted literature
- US20170084586A1 LED CHIP PACKAGE Public/Granted day:2017-03-23
Information query
IPC分类:
