- Patent Title: Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
-
Application No.: US15364534Application Date: 2016-11-30
-
Publication No.: US09824974B2Publication Date: 2017-11-21
- Inventor: Guilian Gao , Cyprian Emeka Uzoh , Charles G. Woychik , Hong Shen , Arkalgud R. Sitaram , Liang Wang , Akash Agrawal , Rajesh Katkar
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: INVENSAS CORPORATION
- Current Assignee: INVENSAS CORPORATION
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/538 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L23/31 ; H01L21/48 ; H01L21/683 ; H01L23/498 ; H01L23/14 ; H01L23/15
Abstract:
Die (110) and/or undiced wafers and/or multichip modules (MCMs) are attached on top of an interposer (120) or some other structure (e.g. another integrated circuit) and are covered by an encapsulant (160). Then the interposer is thinned from below. Before encapsulation, a layer (410) more rigid than the encapsulant is formed on the interposer around the die to reduce or eliminate interposer dishing between the die when the interposer is thinned by a mechanical process (e.g. CMP). Other features are also provided.
Public/Granted literature
Information query
IPC分类:
