Invention Grant
- Patent Title: Three-dimensional power distribution interconnect structure
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Application No.: US14295427Application Date: 2014-06-04
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Publication No.: US09825437B2Publication Date: 2017-11-21
- Inventor: Debabrata Pal , Michael Krenz , John Horowy , Eric Karlen
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee Address: US NC Charlotte
- Agency: Cantor Colburn LLP
- Main IPC: H02B1/56
- IPC: H02B1/56 ; H05K7/20 ; H02B1/20 ; H02B1/015 ; B60R16/02

Abstract:
An electrical power distribution system for a mobile platform, and a method for making such, includes a forming a substrate having a first panel connected to a second panel. The first panel resides in a first plane that differs from a second plan in which the second panel resides. One or more bus bars are arranged on the first panel, with one or more power electronic devices arranged on the first panel and connected to the one or more bus bars. One or more connectors are arranged on the second panel and electrically connected to the one or more bus bars. Finally, one or more thermal relief devices are arranged in contact with the substrate.
Public/Granted literature
- US20150357800A1 THREE-DIMENSIONAL POWER DISTRIBUTION INTERCONNECT STRUCTURE Public/Granted day:2015-12-10
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