- 专利标题： Substrateless integrated circuit packages and methods of forming same
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申请号： US14479044申请日： 2014-09-05
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公开(公告)号： US09842825B2公开(公告)日： 2017-12-12
- 发明人: Lin-Chih Huang , Hung-An Teng , Hsin-Yu Chen , Tsang-Jiuh Wu , Cheng-Chieh Hsieh
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/00 ; H01L21/78 ; H01L23/538 ; H01L23/498 ; H01L21/683 ; H01L25/065 ; H01L25/00 ; H01L23/14 ; H01L21/56 ; H01L23/31
摘要：
Integrated circuit packages and methods of forming the same are provided. One or more redistribution layers are formed on a carrier. First connectors are formed on a first side of the RDLs. Dies are bonded to the first side of the RDLs using the first connectors. An encapsulant is formed on the first side of the RDLs around the dies. The carrier is de-bonded from the overlaying structure and second connectors are formed on a second side of the RDLs. The resulting structure in diced to form individual packages.
公开/授权文献
- US20160071816A1 Integrated Circuit Packages and Methods of Forming Same 公开/授权日：2016-03-10
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