- 专利标题: Bonded article and method for manufacturing bonded article
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申请号: US15514633申请日: 2015-12-08
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公开(公告)号: US09849539B2公开(公告)日: 2017-12-26
- 发明人: Yasuo Kadoya , Hiroji Sasaki
- 申请人: ORIGIN ELECTRIC COMPANY, LIMITED
- 申请人地址: JP Saitama
- 专利权人: ORIGIN ELECTRIC COMPANY, LIMITED
- 当前专利权人: ORIGIN ELECTRIC COMPANY, LIMITED
- 当前专利权人地址: JP Saitama
- 代理机构: Squire Patton Boggs (US) LLP
- 优先权: JP2014-248916 20141209
- 国际申请: PCT/JP2015/084405 WO 20151208
- 国际公布: WO2016/093232 WO 20160616
- 主分类号: B23K11/20
- IPC分类号: B23K11/20 ; B23K20/00 ; B23K11/00 ; B23K103/18
摘要:
A method for manufacturing a bonded article having long bonding length and high strength. A first bonding target member and a second bonding target member having a hole portion for receiving the first member are provided. Pressing force is applied between the two members with the first member received in the hole portion, and a current is applied to a bonding target portion between the two members with the pressing force applied. The two members are of materials with different melting points. One of the two members, having lower melting point, has a heat capacity increasing portion in the vicinity of the target portion. The one of the members has a taper face at the target portion, and the heat capacity increasing portion has a face extending from the taper face. The force applying step is performed with the other member positioned not to contact the heat capacity increasing portion.
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