- 专利标题： Use of an external getter to reduce package pressure
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申请号： US15402329申请日： 2017-01-10
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公开(公告)号： US09865519B2公开(公告)日： 2018-01-09
- 发明人: Stephen H. Black , Adam M. Kennedy
- 申请人： RAYTHEON COMPANY
- 申请人地址： US MA Waltham
- 专利权人： RAYTHEON COMPANY
- 当前专利权人： RAYTHEON COMPANY
- 当前专利权人地址： US MA Waltham
- 代理机构： Lando & Anastasi, LLP
- 主分类号： H01L23/26
- IPC分类号： H01L23/26 ; H01L23/10 ; H01L21/48 ; H01L21/54 ; H01L23/04
摘要：
A system and method for forming a wafer level package. In one example, a substrate used in the wafer level package includes a surface defined by a wafer level package (WLP) region and an external region, and a layer of getter material is disposed on at least a portion of the external region. According to one embodiment, the external region comprises a saw-to-reveal (STR) region of the wafer.
公开/授权文献
- US20170148695A1 USE OF AN EXTERNAL GETTER TO REDUCE PACKAGE PRESSURE 公开/授权日：2017-05-25
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