Invention Grant
- Patent Title: Method for manufacturing thermal bimorph diaphragm and MEMS speaker with thermal bimorphs
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Application No.: US15305089Application Date: 2014-08-26
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Publication No.: US09866971B2Publication Date: 2018-01-09
- Inventor: Quanbo Zou , Zhe Wang , Jifang Tao , Guanxun Qiu
- Applicant: GOERTEK INC.
- Applicant Address: CN WeiFang
- Assignee: GOERTEK INC.
- Current Assignee: GOERTEK INC.
- Current Assignee Address: CN WeiFang
- International Application: PCT/CN2014/085204 WO 20140826
- International Announcement: WO2016/029357 WO 20160303
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R19/02 ; H04R7/06 ; H04R31/00 ; H04R19/01 ; B81B7/00 ; B81C1/00

Abstract:
The present invention provides a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate to obtain an insulating layer thereon and providing a metal layer on the insulating layer; providing a sacrificial layer on the metal layer; providing a first thermal bimorph layer on the sacrificial layer; providing a second thermal bimorph layer on the first thermal bimorph layer; providing a metal connecting layer at the positions on the metal layer where the sacrificial layer is not provided; forming corresponding back holes on the substrate and the insulating layer and releasing the sacrificial layer; forming the thermal bimorph diaphragm which is warped with the first thermal bimorph layer and the second thermal bimorph layer after the sacrificial layer is released.
Public/Granted literature
- US20170041719A1 METHOD FOR MANUFACTURING THERMAL BIMORPH DIAPHRAGM AND MEMS SPEAKER WITH THERMAL BIMORPHS Public/Granted day:2017-02-09
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