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公开(公告)号：US20200267480A1
公开(公告)日：2020-08-20
申请号：US16640022
申请日：2018-09-06
发明人： Quanbo Zou , Qunwen Leng , Zhe Wang
IPC分类号： H04R19/04
摘要： An MEMS microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein: one of the vibration diaphragm and the first substrate is provided with a magnetic film, and the other one of the vibration diaphragm and the first substrate is provided with a magnetoresistive sensor cooperating with the magnetic film, the magnetoresistive sensor being configured to sense a change in a magnetic field of the magnetic film during a vibration of the vibration diaphragm and output a varying electrical signal.
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公开(公告)号：US20200092658A1
公开(公告)日：2020-03-19
申请号：US16609194
申请日：2017-05-05
申请人： GOERTEK INC.
发明人： Quanbo Zou , Zhe Wang , Jialiang Yan
摘要： A MEMS microphone, comprising a packaging structure that is enveloped by a PCB substrate (1) and a housing (2), wherein the packaging structure is provided with a MEMS acoustoelectric chip (3) therein, and the PCB substrate (1) is provided with a sound port (11) at a position that is corresponding to the MEMS acoustoelectric chip (3), wherein, the MEMS microphone further comprises a filter (5), wherein the filter (5) is embedded into a back cavity of the MEMS acoustoelectric chip (3), the filter (5) and the PCB substrate (1) have a lateral hole therebetween, and the lateral hole serves as a sound channel that is used by the MEMS acoustoelectric chip (3) to gather sound. The MEMS microphone can prevent gas shock, block the interfering to the MEMS microphone by kinetic particles, keep the acoustic performance of the MEMS microphone, and reduce the packaging size of the MEMS microphone.
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公开(公告)号：US10306372B2
公开(公告)日：2019-05-28
申请号：US15311152
申请日：2014-08-26
申请人： GOERTEK INC.
发明人： Quanbo Zou , Zhe Wang
IPC分类号： H04R3/00 , H04R17/02 , H04R9/06 , H04R19/00 , B81B7/00 , H04R19/04 , H04R31/00 , B81B3/00 , B81C1/00
摘要： The present invention provides a method for manufacturing a fully wafer-level-packaged MEMS microphone and a microphone manufactured with the same, the method comprises: separately manufacturing a first packaging wafer, an MEMS microphone wafer and a second packaging wafer; performing wafer-to-wafer bonding for the three wafers to form a plurality of fully wafer-level-packaged MEMS microphone units; singulating the fully wafer-level-packaged MEMS microphone units to form a plurality of fully wafer-level-packaged MEMS microphones, which are fully packaged at wafer level and do not need any further process after die singulation. The method can improve cost-effectiveness, performance consistency, manufacturability, quality, scaling capability of the packaged MEMS microphone.
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公开(公告)号：US20180242092A1
公开(公告)日：2018-08-23
申请号：US15772580
申请日：2015-11-03
申请人： Goertek Inc.
发明人： Quanbo Zou , Zhe Wang , Yan Loke
CPC分类号： H04R31/003 , B81B2201/0257 , H04R19/04 , H04R31/00 , H04R2201/003
摘要： A MEMS microphone chip trimming method, apparatus, manufacturing method and microphone are disclosed herein. The method for trimming MEMS microphone chips comprises: detecting a pull-in voltage distribution of MEMS microphone chips on a wafer; providing a mask based on the pull-in voltage distribution; and trimming the MEMS microphone chips on the wafer by using the mask.
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5.发明申请公开(公告)号：US20170330857A1
公开(公告)日：2017-11-16
申请号：US15531270
申请日：2015-07-14
申请人： Goertek, Inc.
发明人： Quanbo Zou , Zhe Wang
IPC分类号： H01L23/00 , H01L33/62 , H01L25/075
CPC分类号： H01L24/97 , H01L24/81 , H01L24/83 , H01L25/0753 , H01L33/0079 , H01L33/0095 , H01L33/20 , H01L33/62 , H01L2224/81005 , H01L2224/81143 , H01L2224/81815 , H01L2224/83005 , H01L2224/83143 , H01L2224/83851 , H01L2224/95001 , H01L2224/95144 , H01L2224/95145 , H01L2924/12041 , H01L2933/0066
摘要： The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming micro-LEDs on a laser-transparent original substrate; irradiating the original substrate with laser from the original substrate side to lift-off the micro-LEDs from the original substrate; bring the micro-LEDs into contact with pads preset on a receiving substrate through a contactless action.
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公开(公告)号：US11297441B2
公开(公告)日：2022-04-05
申请号：US16640015
申请日：2018-09-06
发明人： Quanbo Zou , Qunwen Leng , Zhe Wang
摘要： The present disclosure discloses a microphone, comprising: a first substrate, the first substrate having an inner cavity open at one end, wherein the microphone further comprises a vibration diaphragm and at least one cantilever which are provided to the first substrate and suspended above the inner cavity. The cantilever is separated from the vibration diaphragm by a spacing portion, and the vibration diaphragm and the inner cavity of the first substrate define an acoustically sealed cavity; and a detection structure is provided to the vibration diaphragm and the cantilever. The structural design of the cantilever is adopted, so that the space between the vibration diaphragm and the cantilever is open, the airflow can smoothly pass by the cantilever, and further the signal-to-noise ratio of the microphone can be greatly improved.
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公开(公告)号：US11109162B2
公开(公告)日：2021-08-31
申请号：US16609194
申请日：2017-05-05
申请人： GOERTEK INC.
发明人： Quanbo Zou , Zhe Wang , Jialiang Yan
摘要： A MEMS microphone, comprising a packaging structure that is enveloped by a PCB substrate (1) and a housing (2), wherein the packaging structure is provided with a MEMS acoustoelectric chip (3) therein, and the PCB substrate (1) is provided with a sound port (11) at a position that is corresponding to the MEMS acoustoelectric chip (3), wherein, the MEMS microphone further comprises a filter (5), wherein the filter (5) is embedded into a back cavity of the MEMS acoustoelectric chip (3), the filter (5) and the PCB substrate (1) have a lateral hole therebetween, and the lateral hole serves as a sound channel that is used by the MEMS acoustoelectric chip (3) to gather sound. The MEMS microphone can prevent gas shock, block the interfering to the MEMS microphone by kinetic particles, keep the acoustic performance of the MEMS microphone, and reduce the packaging size of the MEMS microphone.
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公开(公告)号：US11102586B2
公开(公告)日：2021-08-24
申请号：US16640022
申请日：2018-09-06
发明人： Quanbo Zou , Qunwen Leng , Zhe Wang
IPC分类号： H04R19/04
摘要： An MEMS microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein: one of the vibration diaphragm and the first substrate is provided with a magnetic film, and the other one of the vibration diaphragm and the first substrate is provided with a magnetoresistive sensor cooperating with the magnetic film, the magnetoresistive sensor being configured to sense a change in a magnetic field of the magnetic film during a vibration of the vibration diaphragm and output a varying electrical signal.
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公开(公告)号：US11099467B2
公开(公告)日：2021-08-24
申请号：US16483156
申请日：2017-02-06
申请人： GOERTEK INC.
发明人： Zhe Wang , Quanbo Zou , Qinglin Song , Jialiang Yan , Yujing Lin , Xiaoyang Zhang
摘要： A micro laser diode projector comprises: an MEMS scanning device, which rotates around a first axis and a second axis that are orthogonal to each other; and a micro laser diode light source including at least one micro laser diode, wherein the micro laser diode light source is mounted on the MEMS scanning device and rotates around the first and second axes with the MEMS scanning device to project light to a projection screen. An electronics apparatus including the micro laser diode projector is also discussed.
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公开(公告)号：US20200236471A1
公开(公告)日：2020-07-23
申请号：US16640015
申请日：2018-09-06
发明人： Quanbo Zou , Qunwen Leng , Zhe Wang
摘要： The present disclosure discloses a microphone, comprising: a first substrate, the first substrate having an inner cavity open at one end, wherein the microphone further comprises a vibration diaphragm and at least one cantilever which are provided to the first substrate and suspended above the inner cavity. The cantilever is separated from the vibration diaphragm by a spacing portion, and the vibration diaphragm and the inner cavity of the first substrate define an acoustically sealed cavity; and a detection structure is provided to the vibration diaphragm and the cantilever. The structural design of the cantilever is adopted, so that the space between the vibration diaphragm and the cantilever is open, the airflow can smoothly pass by the cantilever, and further the signal-to-noise ratio of the microphone can be greatly improved.
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