Invention Grant
- Patent Title: Packaged integrated circuit device with cantilever structure
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Application No.: US14866576Application Date: 2015-09-25
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Publication No.: US09871007B2Publication Date: 2018-01-16
- Inventor: John G. Meyers , Bilal Khalaf , Sireesha Gogineni , Brian J. Long
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe Williamson & Wyatt P.C.
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/58 ; H01L21/52 ; H01L21/66 ; H01L25/065 ; H01L25/00 ; H01L23/13 ; H01L25/16 ; H01L23/31 ; H01L23/498 ; H01L23/00
Abstract:
Techniques and mechanisms to facilitate connection with one or more integrated circuit (IC) dies of a packaged device. In an embodiment, the packaged device includes a first substrate coupled to a first side of a package, and a second substrate coupled to a second side of the package opposite the first side. Circuitry, coupled via the first substrate to one or more IC dies disposed in the package, includes a circuit structure disposed at a cantilever portion of the first substrate. The cantilever portion extends past one or both of an edge of the first side and an edge of the second side. In another embodiment, a hardware interface disposed on the second substrate enables coupling of the packaged device to another device.
Public/Granted literature
- US20170092602A1 PACKAGED INTEGRATED CIRCUIT DEVICE WITH CANTILEVER STRUCTURE Public/Granted day:2017-03-30
Information query
IPC分类:
